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John T. White
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Lancaster, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Low temperature method for fabricating high-aspect ratio vias and d...
Patent number
7,538,032
Issue date
May 26, 2009
Teledyne Scientific & Imaging, LLC
Robert L. Borwick
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer plating cell assembly
Patent number
6,989,084
Issue date
Jan 24, 2006
Rockwell Scientific Licensing, LLC
D. Morgan Tench
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit plating using highly-complexed copper plating baths
Patent number
6,709,564
Issue date
Mar 23, 2004
Rockwell Scientific Licensing, LLC
D. Morgan Tench
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor wafer plating cathode assembly
Patent number
6,579,430
Issue date
Jun 17, 2003
Innovative Technology Licensing, LLC
Greg Davis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Controlled plating on reactive metals
Patent number
6,503,343
Issue date
Jan 7, 2003
Innovative Technology Licensing, LLC
D. Morgan Tench
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Electrochemical surface analysis using deoxygenated gel electrolyte
Patent number
6,214,210
Issue date
Apr 10, 2001
Rockwell Technologies, LLC
John T. White
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Low temperature method for fabricating high-aspect ratio vias and d...
Publication number
20060292866
Publication date
Dec 28, 2006
Robert L. Borwick
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Copper bath for electroplating fine circuitry on semiconductor chips
Publication number
20050067297
Publication date
Mar 31, 2005
INNOVATIVE TECHNOLOGY LICENSING, LLC
D. Morgan Tench
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Semiconductor wafer plating cathode assembly
Publication number
20030085119
Publication date
May 8, 2003
INNOVATIVE TECHNOLOGY LICENSING, LLC
Greg Davis
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
Semiconductor wafer plating cell assembly
Publication number
20030085118
Publication date
May 8, 2003
INNOVATIVE TECHNOLOGY LICENSING, LLC
D. Morgan Tench
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR