John Tang

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Ceramic/organic hybrid substrate
- Patent number 7,714,432
- Issue date May 11, 2010
- Intel Corporation
- John Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level bonding for mechanically reinforced ultra-thin die
- Patent number 7,435,664
- Issue date Oct 14, 2008
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupled signal-power substrate architecture
- Patent number 7,405,364
- Issue date Jul 29, 2008
- Intel Corporation
- Rajendran Nair
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost microelectronic circuit package
- Patent number 7,183,658
- Issue date Feb 27, 2007
- Intel Corporation
- Steven Towle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance, low cost microelectronic circuit package with int...
- Patent number 6,888,240
- Issue date May 3, 2005
- Intel Corporation
- Steven Towle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly
- Patent number 6,803,649
- Issue date Oct 12, 2004
- Intel Corporation
- Jiangqi He
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
WAFER-LEVEL BONDING FOR MECHANICALLY REINFORCED ULTRA-THIN DIE
- Publication number 20080265407
- Publication date Oct 30, 2008
- Intel Corporation
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer-level bonding for mechanically reinforced ultra-thin die
- Publication number 20080003720
- Publication date Jan 3, 2008
- Daoqiang Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Decoupled signal-power substrate architecture
- Publication number 20040124004
- Publication date Jul 1, 2004
- Rajendran Nair
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ceramic/organic hybrid substrate
- Publication number 20040016996
- Publication date Jan 29, 2004
- Intel Corporation
- John Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low cost microelectronic circuit package
- Publication number 20030045083
- Publication date Mar 6, 2003
- Intel Corporation
- Steven Towle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance, low cost microelectronic circuit package with int...
- Publication number 20020158335
- Publication date Oct 31, 2002
- Intel Corporation
- Steven Towle
- H01 - BASIC ELECTRIC ELEMENTS