John Thomas Sprietsma

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interchangeable connection arrays for double-sided DIMM placement
- Patent number 8,775,991
- Issue date Jul 8, 2014
- Intel Corporation
- Michael W. Leddige
- G11 - INFORMATION STORAGE
Information Patent Grant
Interchangeable connection arrays for double-sided DIMM placement
- Patent number 8,438,515
- Issue date May 7, 2013
- Intel Corporation
- Michael W. Leddige
- G11 - INFORMATION STORAGE
Information Patent Grant
Interchangeable connection arrays for double-sided DIMM placement
- Patent number 8,099,687
- Issue date Jan 17, 2012
- Intel Corporation
- Michael W. Leddige
- G11 - INFORMATION STORAGE
Information Patent Grant
Multiple return terminal power supply methods and apparatus
- Patent number 6,952,783
- Issue date Oct 4, 2005
- Intel Corporation
- Henry W. Koertzen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Ball grid array circuit board jumper
- Patent number 6,739,879
- Issue date May 25, 2004
- Intel Corporation
- John T. Sprietsma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for improving circuit board solder
- Patent number 6,429,383
- Issue date Aug 6, 2002
- Intel Corporation
- John T. Sprietsma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple layer printed circuit board having power planes on outer l...
- Patent number 6,288,906
- Issue date Sep 11, 2001
- Intel Corporation
- John T. Sprietsma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board and manufacturing method thereof
- Patent number 6,180,215
- Issue date Jan 30, 2001
- Intel Corporation
- John T. Sprietsma
- B32 - LAYERED PRODUCTS
Information Patent Grant
Via pad geometry supporting uniform transmission line structures
- Patent number 6,111,205
- Issue date Aug 29, 2000
- Intel Corporation
- Michael Leddige
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Equal length symmetric computer bus topology
- Patent number 5,548,734
- Issue date Aug 20, 1996
- Intel Corporation
- Jerzy Kolinski
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
INTERCHANGEABLE CONNECTION ARRAYS FOR DOUBLE-SIDED DIMM PLACEMENT
- Publication number 20130341790
- Publication date Dec 26, 2013
- Michael W. Leddige
- G11 - INFORMATION STORAGE
Information Patent Application
INTERCHANGEABLE CONNECTION ARRAYS FOR DOUBLE-SIDED DIMM PLACEMENT
- Publication number 20120199973
- Publication date Aug 9, 2012
- Michael W. Leddige
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
TEST ACCESS FOR HIGH DENSITY INTERCONNECT BOARDS
- Publication number 20090004891
- Publication date Jan 1, 2009
- James Grealish
- G01 - MEASURING TESTING
Information Patent Application
Memory module routing
- Publication number 20080266778
- Publication date Oct 30, 2008
- INTEL CORPORATION
- John T. Sprietsma
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Interchangeable connection arrays for double-sided DIMM placement
- Publication number 20080062734
- Publication date Mar 13, 2008
- Michael W. Leddige
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Memory module circuit board layer routing
- Publication number 20060137903
- Publication date Jun 29, 2006
- John T. Sprietsma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Memory module routing
- Publication number 20060139983
- Publication date Jun 29, 2006
- John T. Sprietsma
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Interchangeable connection arrays for double-sided memory module pl...
- Publication number 20050195629
- Publication date Sep 8, 2005
- Michael W. Leddige
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BALL GRID ARRAY JUMPER
- Publication number 20040005790
- Publication date Jan 8, 2004
- Intel Corporation
- John T. Sprietsma
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power supply method and apparatus
- Publication number 20030090248
- Publication date May 15, 2003
- Intel Corporation
- Henry W. Koertzen
- G06 - COMPUTING CALCULATING COUNTING

John Thomas Sprietsma

Person

Patents Grantslast 30 patents

Interchangeable connection arrays for double-sided DIMM placement

Interchangeable connection arrays for double-sided DIMM placement

Interchangeable connection arrays for double-sided DIMM placement

Multiple return terminal power supply methods and apparatus

Ball grid array circuit board jumper

Apparatus and method for improving circuit board solder

Multiple layer printed circuit board having power planes on outer l...

Multilayer printed circuit board and manufacturing method thereof

Via pad geometry supporting uniform transmission line structures

Equal length symmetric computer bus topology

Patents Applicationslast 30 patents

INTERCHANGEABLE CONNECTION ARRAYS FOR DOUBLE-SIDED DIMM PLACEMENT

INTERCHANGEABLE CONNECTION ARRAYS FOR DOUBLE-SIDED DIMM PLACEMENT

TEST ACCESS FOR HIGH DENSITY INTERCONNECT BOARDS

Memory module routing

Interchangeable connection arrays for double-sided DIMM placement

Memory module circuit board layer routing

Memory module routing

Interchangeable connection arrays for double-sided memory module pl...

BALL GRID ARRAY JUMPER

Power supply method and apparatus