John Timmerman

Person

Minneapolis, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface material with mixed aspect ratio particle dispers...
- Patent number 11,447,677
- Issue date Sep 20, 2022
- Henkel AG & Co. KGaA
- John Timmerman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Thermally conductive EMI suppression compositions
- Patent number 9,999,158
- Issue date Jun 12, 2018
- Henkel IP & Holding GmbH
- Sanjay Misra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally conductive dielectric interface
- Patent number 9,693,481
- Issue date Jun 27, 2017
- Henkel IP & Holding GmbH
- John Timmerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material with mixed aspect ratio particle dispers...
- Patent number 9,611,414
- Issue date Apr 4, 2017
- Henkel IP & Holding GmbH
- John Timmerman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NON-SILICONE THERMAL INTERFACE MATERIAL
- Publication number 20240279426
- Publication date Aug 22, 2024
- Henkel AG & Co. KGaA
- Yuqiang Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICONE FREE THERMAL INTERFACE MATERIAL WITH REACTIVE DILUENT
- Publication number 20220328902
- Publication date Oct 13, 2022
- Henkel AG & Co. KGaA
- John Timmerman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIALS
- Publication number 20210388203
- Publication date Dec 16, 2021
- Henkel IP & Holding GmbH
- Chunyong Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Interface Material with Mixed Aspect Ratio Particle Dispers...
- Publication number 20190322918
- Publication date Oct 24, 2019
- Henkel IP & Holding GmbH
- JOHN TIMMERMAN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermal Interface Material with Mixed Aspect Ratio Particle Dispers...
- Publication number 20170158936
- Publication date Jun 8, 2017
- Henkel IP & Holding GmbH
- JOHN TIMMERMAN
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermal Interface Material with Mixed Aspect Ratio Particle Dispers...
- Publication number 20160009975
- Publication date Jan 14, 2016
- The Bergquist Company
- John Timmerman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Thermally Conductive Dielectric Interface
- Publication number 20140374071
- Publication date Dec 25, 2014
- John Timmerman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermally Conductive EMI Suppression Compositions
- Publication number 20140182924
- Publication date Jul 3, 2014
- The Bergquist Company
- Sanjay Misra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual Cure Thermally Conductive Adhesive
- Publication number 20130042972
- Publication date Feb 21, 2013
- John Timmerman
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Oriented Members for Thermally Conductive Interface Structures
- Publication number 20090208722
- Publication date Aug 20, 2009
- John Francis Timmerman
- B32 - LAYERED PRODUCTS

John Timmerman

Person

Patents Grantslast 30 patents

Thermal interface material with mixed aspect ratio particle dispers...

Thermally conductive EMI suppression compositions

Thermally conductive dielectric interface

Thermal interface material with mixed aspect ratio particle dispers...

Patents Applicationslast 30 patents

NON-SILICONE THERMAL INTERFACE MATERIAL

SILICONE FREE THERMAL INTERFACE MATERIAL WITH REACTIVE DILUENT

THERMAL INTERFACE MATERIALS

Thermal Interface Material with Mixed Aspect Ratio Particle Dispers...

Thermal Interface Material with Mixed Aspect Ratio Particle Dispers...

Thermal Interface Material with Mixed Aspect Ratio Particle Dispers...

Thermally Conductive Dielectric Interface

Thermally Conductive EMI Suppression Compositions

Dual Cure Thermally Conductive Adhesive

Oriented Members for Thermally Conductive Interface Structures