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John Urbahn
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Hampstead, NH, US
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last 30 patents
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Patent Grant
Use of pulsed-DC wafer bias for filling vias/trenches with metal in...
Patent number
6,051,114
Issue date
Apr 18, 2000
Applied Materials, Inc.
Tse-Yong Yao
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...