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John W. Roman

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  • Natick, MA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Modular low stress package technology
    • Patent number 8,759,965
    • Issue date Jun 24, 2014
    • STMicroelectronics, Inc.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Modular low stress package technology
    • Patent number 8,639,373
    • Issue date Jan 28, 2014
    • STMicroelectronics, Inc.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Modular low stress package technology
    • Patent number 8,560,104
    • Issue date Oct 15, 2013
    • STMicroelectronics, Inc.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Modular low stress package technology
    • Patent number 8,283,769
    • Issue date Oct 9, 2012
    • STMicroelectronics, Inc.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Modular low stress package technology
    • Patent number 8,153,474
    • Issue date Apr 10, 2012
    • STMicroelectronics, Inc.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Solid interface module
    • Patent number 6,324,755
    • Issue date Dec 4, 2001
    • Raytheon Company
    • Michael T. Borkowski
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Integrated DC/RF connector
    • Patent number 5,154,625
    • Issue date Oct 13, 1992
    • Raytheon Company
    • Michael R. Borokowski
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY
    • Publication number 20110086469
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY
    • Publication number 20110087356
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY
    • Publication number 20110084371
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY
    • Publication number 20110084376
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MODULAR LOW STRESS PACKAGE TECHNOLOGY
    • Publication number 20110087353
    • Publication date Apr 14, 2011
    • STMICROELECTRONICS, INC.
    • Craig J. Rotay
    • H01 - BASIC ELECTRIC ELEMENTS