John W. Stafford

Person

St. Charles, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Latching micro magnetic relay packages and methods of packaging
- Patent number 7,151,426
- Issue date Dec 19, 2006
- Magfusion Inc.
- John Stafford
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
PCB with embedded optical fiber
- Patent number 7,125,176
- Issue date Oct 24, 2006
- John W. Stafford
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micromagnetic latching switch packaging
- Patent number 6,894,592
- Issue date May 17, 2005
- Magfusion, Inc.
- Jun Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Latching micro magnetic relay packages and methods of packaging
- Patent number 6,778,046
- Issue date Aug 17, 2004
- Magfusion Inc.
- John Stafford
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor laser package and method of fabrication
- Patent number 5,905,750
- Issue date May 18, 1999
- Motorola, Inc.
- Michael S. Lebby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smartcard and method of making
- Patent number 5,892,661
- Issue date Apr 6, 1999
- Motorola, Inc.
- John W. Stafford
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor laser package with power monitoring system and optica...
- Patent number 5,838,703
- Issue date Nov 17, 1998
- Motorola, Inc.
- Michael S. Lebby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluxless flip-chip bond and a method for making
- Patent number 5,816,478
- Issue date Oct 6, 1998
- Motorola, Inc.
- Kenneth Kaskoun
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated electro-optical package
- Patent number 5,818,404
- Issue date Oct 6, 1998
- Motorola, Inc.
- Michael S. Lebby
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Three dimensional semiconductor package having flexible appendages
- Patent number 5,789,815
- Issue date Aug 4, 1998
- Motorola, Inc.
- Theodore G. Tessier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electro-optical package with LED display chip and substr...
- Patent number 5,739,800
- Issue date Apr 14, 1998
- Motorola
- Michael S. Lebby
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated electro-optical package with carrier ring and method of...
- Patent number 5,699,073
- Issue date Dec 16, 1997
- Motorola
- Michael S. Lebby
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Integrated electro-optical package
- Patent number 5,689,279
- Issue date Nov 18, 1997
- Motorola
- Ronald J. Nelson
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Integrated electro-optic package
- Patent number 5,650,640
- Issue date Jul 22, 1997
- Motorola
- John W. Stafford
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic transducer
- Patent number 5,627,931
- Issue date May 6, 1997
- Motorola
- Donald E. Ackley
- G02 - OPTICS
Information Patent Grant
Integrated electro-optical package
- Patent number 5,612,549
- Issue date Mar 18, 1997
- Motorola
- Ronald J. Nelson
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Integrated circuit testing board having constrained thermal expansi...
- Patent number 5,602,491
- Issue date Feb 11, 1997
- Motorola, Inc.
- Barbara Vasquez
- G01 - MEASURING TESTING
Information Patent Grant
Electrical contact and method for making an electrical contact
- Patent number 5,446,247
- Issue date Aug 29, 1995
- Motorola, Inc.
- Lubomir Cergel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electro-optical package
- Patent number 5,432,358
- Issue date Jul 11, 1995
- Motorola, Inc.
- Ronald J. Nelson
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Laser etch-back process for forming a metal feature on a non-metal...
- Patent number 5,221,426
- Issue date Jun 22, 1993
- Motorola Inc.
- Theodore G. Tessier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump transfer method
- Patent number 5,217,597
- Issue date Jun 8, 1993
- Motorola, Inc.
- Kevin D. Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder plate reflow method for forming solder-bumped terminals
- Patent number 5,194,137
- Issue date Mar 16, 1993
- Motorola Inc.
- Kevin D. Moore
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder plate reflow method for forming a solder bump on a circuit t...
- Patent number 5,160,409
- Issue date Nov 3, 1992
- Motorola, Inc.
- Kevin D. Moore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical component package comprising polymer-reinforced solder b...
- Patent number 5,120,678
- Issue date Jun 9, 1992
- Motorola Inc.
- Kevin D. Moore
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Latching micro magnetic relay packages and methods of packaging
- Publication number 20040027218
- Publication date Feb 12, 2004
- John Stafford
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LATCHING MICRO MAGNETIC RELAY PACKAGES AND METHODS OF PACKAGING
- Publication number 20030151479
- Publication date Aug 14, 2003
- John Stafford
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Mircomagnetic latching switch packaging
- Publication number 20030011450
- Publication date Jan 16, 2003
- Jun Shen
- H01 - BASIC ELECTRIC ELEMENTS

John W. Stafford

Person

Patents Grantslast 30 patents

Latching micro magnetic relay packages and methods of packaging

PCB with embedded optical fiber

Micromagnetic latching switch packaging

Latching micro magnetic relay packages and methods of packaging

Semiconductor laser package and method of fabrication

Smartcard and method of making

Semiconductor laser package with power monitoring system and optica...

Fluxless flip-chip bond and a method for making

Integrated electro-optical package

Three dimensional semiconductor package having flexible appendages

Integrated electro-optical package with LED display chip and substr...

Integrated electro-optical package with carrier ring and method of...

Integrated electro-optical package

Integrated electro-optic package

Optoelectronic transducer

Integrated electro-optical package

Integrated circuit testing board having constrained thermal expansi...

Electrical contact and method for making an electrical contact

Integrated electro-optical package

Laser etch-back process for forming a metal feature on a non-metal...

Solder bump transfer method

Solder plate reflow method for forming solder-bumped terminals

Solder plate reflow method for forming a solder bump on a circuit t...

Electrical component package comprising polymer-reinforced solder b...

Patents Applicationslast 30 patents

Latching micro magnetic relay packages and methods of packaging

LATCHING MICRO MAGNETIC RELAY PACKAGES AND METHODS OF PACKAGING

Mircomagnetic latching switch packaging