John Y. Spann

Person

Albuquerque, NM, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integration of an unprocessed, direct-bandgap chip into a silicon p...
- Patent number 11,181,688
- Issue date Nov 23, 2021
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted metamorphic multijunction solar cells including metamorphi...
- Patent number 10,381,505
- Issue date Aug 13, 2019
- SolAero Technologies Corp.
- Pravin Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted metamorphic multijunction solar cell including a metamorph...
- Patent number 10,374,112
- Issue date Aug 6, 2019
- SolAero Technologies Corp.
- Arthur Cornfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor layer variation for substrate removal after bonding
- Patent number 10,243,314
- Issue date Mar 26, 2019
- Skorpios Technologies, Inc.
- John Y. Spann
- G02 - OPTICS
Information Patent Grant
Semiconductor bonding with compliant resin and utilizing hydrogen i...
- Patent number 9,991,149
- Issue date Jun 5, 2018
- Skorpios Technologies, Inc.
- Damien Lambert
- G02 - OPTICS
Information Patent Grant
Processing of a direct-bandgap chip after bonding to a silicon phot...
- Patent number 9,923,105
- Issue date Mar 20, 2018
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures for bonding a direct-bandgap chip to a silicon photonic...
- Patent number 9,882,073
- Issue date Jan 30, 2018
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid optical modulator
- Patent number 9,568,750
- Issue date Feb 14, 2017
- Skorpios Technologies, Inc.
- John Y. Spann
- G02 - OPTICS
Information Patent Grant
Coplanar integration of a direct-bandgap chip into a silicon photon...
- Patent number 9,496,431
- Issue date Nov 15, 2016
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted metamorphic multijunction solar cell with metamorphic layers
- Patent number 9,356,176
- Issue date May 31, 2016
- SolAero Technologies Corp.
- Arthur Cornfeld
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Method and system for height registration during chip bonding
- Patent number 9,324,682
- Issue date Apr 26, 2016
- Skorpios Technologies, Inc.
- Elton Marchena
- G02 - OPTICS
Information Patent Grant
Integration of an unprocessed, direct-bandgap chip into a silicon p...
- Patent number 9,316,785
- Issue date Apr 19, 2016
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- G02 - OPTICS
Information Patent Grant
Semiconductor bonding with compliant resin and utilizing hydrogen i...
- Patent number 9,209,142
- Issue date Dec 8, 2015
- Skorpios Technologies, Inc.
- Damien Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverted metamorphic multijunction solar cell with two metamorphic...
- Patent number 9,117,966
- Issue date Aug 25, 2015
- SolAero Technologies Corp.
- Arthur Cornfeld
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATION OF AN UNPROCESSED, DIRECT-BANDGAP CHIP INTO A SILICON P...
- Publication number 20220171125
- Publication date Jun 2, 2022
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LAYER VARIATION FOR SUBSTRATE REMOVAL AFTER BONDING
- Publication number 20170085056
- Publication date Mar 23, 2017
- Skorpios Technologies, Inc.
- John Y. Spann
- G02 - OPTICS
Information Patent Application
INVERTED METAMORPHIC MULTIJUNCTION SOLAR CELL WITH TWO METAMORPHIC...
- Publication number 20160329454
- Publication date Nov 10, 2016
- SolAero Technologies Corp.
- Pravin Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF AN UNPROCESSED, DIRECT-BANDGAP CHIP INTO A SILICON P...
- Publication number 20160274319
- Publication date Sep 22, 2016
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- G02 - OPTICS
Information Patent Application
INVERTED METAMORPHIC MULTIJUNCTION SOLAR CELL INCLUDING A METAMORP...
- Publication number 20160190378
- Publication date Jun 30, 2016
- SolAero Technologies Corp.
- Arthur Cornfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BONDING WITH COMPLIANT RESIN AND UTILIZING HYDROGEN I...
- Publication number 20160133496
- Publication date May 12, 2016
- Skorpios Technologies, Inc.
- Damien Lambert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INVERTED METAMORPHIC MULTIJUNCTION SOLAR CELL WITH METAMORPHIC LAYERS
- Publication number 20160013348
- Publication date Jan 14, 2016
- SolAero Technologies Corp.
- Arthur Cornfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSING OF A DIRECT-BANDGAP CHIP AFTER BONDING TO A SILICON PHOT...
- Publication number 20150099318
- Publication date Apr 9, 2015
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPLANAR INTEGRATION OF A DIRECT-BANDGAP CHIP INTO A SILICON PHOTON...
- Publication number 20150097210
- Publication date Apr 9, 2015
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES FOR BONDING A DIRECT-BANDGAP CHIP TO A SILICON PHOTONIC...
- Publication number 20150097211
- Publication date Apr 9, 2015
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF AN UNPROCESSED, DIRECT-BANDGAP CHIP INTO A SILICON P...
- Publication number 20150098676
- Publication date Apr 9, 2015
- Skorpios Technologies, Inc.
- Stephen B. Krasulick
- G02 - OPTICS
Information Patent Application
METHOD AND SYSTEM FOR HEIGHT REGISTRATION DURING CHIP BONDING
- Publication number 20140319656
- Publication date Oct 30, 2014
- Skorpios Technologies, Inc.
- Elton Marchena
- G02 - OPTICS
Information Patent Application
HYBRID OPTICAL MODULATOR
- Publication number 20130301975
- Publication date Nov 14, 2013
- Skorpios Technologies, Inc.
- John Y. Spann
- G02 - OPTICS
Information Patent Application
INVERTED METAMORPHIC MULTIJUNCTION SOLAR CELL WITH TWO METAMORPHIC...
- Publication number 20120211068
- Publication date Aug 23, 2012
- Emcore Solar Power, Inc.
- Arthur Cornfeld
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

John Y. Spann

Person

Patents Grantslast 30 patents

Integration of an unprocessed, direct-bandgap chip into a silicon p...

Inverted metamorphic multijunction solar cells including metamorphi...

Inverted metamorphic multijunction solar cell including a metamorph...

Semiconductor layer variation for substrate removal after bonding

Semiconductor bonding with compliant resin and utilizing hydrogen i...

Processing of a direct-bandgap chip after bonding to a silicon phot...

Structures for bonding a direct-bandgap chip to a silicon photonic...

Hybrid optical modulator

Coplanar integration of a direct-bandgap chip into a silicon photon...

Inverted metamorphic multijunction solar cell with metamorphic layers

Method and system for height registration during chip bonding

Integration of an unprocessed, direct-bandgap chip into a silicon p...

Semiconductor bonding with compliant resin and utilizing hydrogen i...

Inverted metamorphic multijunction solar cell with two metamorphic...

Patents Applicationslast 30 patents

INTEGRATION OF AN UNPROCESSED, DIRECT-BANDGAP CHIP INTO A SILICON P...

SEMICONDUCTOR LAYER VARIATION FOR SUBSTRATE REMOVAL AFTER BONDING

INVERTED METAMORPHIC MULTIJUNCTION SOLAR CELL WITH TWO METAMORPHIC...

INTEGRATION OF AN UNPROCESSED, DIRECT-BANDGAP CHIP INTO A SILICON P...

INVERTED METAMORPHIC MULTIJUNCTION SOLAR CELL INCLUDING A METAMORP...

SEMICONDUCTOR BONDING WITH COMPLIANT RESIN AND UTILIZING HYDROGEN I...

INVERTED METAMORPHIC MULTIJUNCTION SOLAR CELL WITH METAMORPHIC LAYERS

PROCESSING OF A DIRECT-BANDGAP CHIP AFTER BONDING TO A SILICON PHOT...

COPLANAR INTEGRATION OF A DIRECT-BANDGAP CHIP INTO A SILICON PHOTON...

STRUCTURES FOR BONDING A DIRECT-BANDGAP CHIP TO A SILICON PHOTONIC...

INTEGRATION OF AN UNPROCESSED, DIRECT-BANDGAP CHIP INTO A SILICON P...

METHOD AND SYSTEM FOR HEIGHT REGISTRATION DURING CHIP BONDING

HYBRID OPTICAL MODULATOR

INVERTED METAMORPHIC MULTIJUNCTION SOLAR CELL WITH TWO METAMORPHIC...