Johnnie Quan

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods for temporary bussing of semiconductor package substrates
- Patent number 9,449,890
- Issue date Sep 20, 2016
- Amkor Technology, Inc.
- Johnnie Quan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with efficient MEMS architecture
- Patent number 9,061,884
- Issue date Jun 23, 2015
- Amkor Technology, Inc.
- August Joseph Miller
- B81 - MICRO-STRUCTURAL TECHNOLOGY