Johshi Gotoh

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Nishinomiya, JP

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Patents Grantslast 30 patents

Information Patent Grant
One-component hot-setting epoxy resin composition and semiconductor...
- Patent number 7,449,362
- Issue date Nov 11, 2008
- Sunstar Giken Kabushiki Kaisha
- Johshi Gotoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Underfilling material for semiconductor package
- Patent number 6,881,591
- Issue date Apr 19, 2005
- Sunstar Suisse SA
- Johshi Gotoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Underfilling material for semiconductor package
- Patent number 6,660,943
- Issue date Dec 9, 2003
- Sunstar Giken Kabushiki Kaisha
- Johshi Gotoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat curable composition
- Patent number 5,866,668
- Issue date Feb 2, 1999
- Sunstar Giken Kabushiki Kaisha
- Nobuhiko Maeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
One-component hot setting epoxy resin composition and semiconductor...
- Publication number 20040209403
- Publication date Oct 21, 2004
- Johshi Gotoh
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Underfilling material for semiconductor package
- Publication number 20040112631
- Publication date Jun 17, 2004
- Sunstar Giken Kabushiki Kaisha
- Johshi Gotoh
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...