JoHyun Bae

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with package stacking
- Patent number 9,349,666
- Issue date May 24, 2016
- Stats Chippac Ltd.
- JoHyun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with multi-chip module
- Patent number 9,330,945
- Issue date May 3, 2016
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with vertical interconnection a...
- Patent number 9,093,392
- Issue date Jul 28, 2015
- Stats Chippac Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with fan-in package and method...
- Patent number 9,093,391
- Issue date Jul 28, 2015
- Stats Chippac Ltd.
- SeungYun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing mold flash prevention t...
- Patent number 8,772,916
- Issue date Jul 8, 2014
- Stats Chippac Ltd.
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with stack device
- Patent number 8,698,297
- Issue date Apr 15, 2014
- Stats Chippac Ltd.
- JoHyun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer and method of m...
- Patent number 8,699,232
- Issue date Apr 15, 2014
- Stats Chippac Ltd.
- A Leam Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with vertical interconnects and...
- Patent number 8,674,516
- Issue date Mar 18, 2014
- Stats Chippac Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with encapsulation and method o...
- Patent number 8,643,181
- Issue date Feb 4, 2014
- Stats Chippac Ltd.
- JoHyun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with encapsulation and method o...
- Patent number 8,569,869
- Issue date Oct 29, 2013
- Stats Chippac Ltd.
- HyungSang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with dual side connection and met...
- Patent number 8,501,535
- Issue date Aug 6, 2013
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging system with an aligned interconnect and met...
- Patent number 8,497,575
- Issue date Jul 30, 2013
- Stats Chippac Ltd.
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with rounded interconnect
- Patent number 8,461,680
- Issue date Jun 11, 2013
- Stats Chippac Ltd.
- JoHyun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with stacked lead and method of...
- Patent number 8,304,900
- Issue date Nov 6, 2012
- Stats Chippac Ltd.
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing mold flash prevention t...
- Patent number 8,252,615
- Issue date Aug 28, 2012
- Stats Chippac Ltd.
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with conductive pillars and met...
- Patent number 8,232,141
- Issue date Jul 31, 2012
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mountable integrated circuit package system with substrate having a...
- Patent number 8,129,832
- Issue date Mar 6, 2012
- Stats Chippac Ltd.
- Flynn Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with rounded interconnect and m...
- Patent number 8,039,275
- Issue date Oct 18, 2011
- Stats Chippac Ltd.
- JoHyun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with conductive pillars and met...
- Patent number 7,923,304
- Issue date Apr 12, 2011
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with dual side connection
- Patent number 7,884,457
- Issue date Feb 8, 2011
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mountable integrated circuit package system with stacking interposer
- Patent number 7,800,212
- Issue date Sep 21, 2010
- Stats Chippac Ltd.
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip package system
- Patent number 7,710,735
- Issue date May 4, 2010
- Stats Chippac Ltd.
- JoHyun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mountable integrated circuit package-in-package system with adhesiv...
- Patent number 7,687,897
- Issue date Mar 30, 2010
- Stats Chippac Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHO...
- Publication number 20130075926
- Publication date Mar 28, 2013
- JoHyun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF M...
- Publication number 20130070438
- Publication date Mar 21, 2013
- A Leam Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND...
- Publication number 20120326331
- Publication date Dec 27, 2012
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MOLD FLASH PREVENTION T...
- Publication number 20120267801
- Publication date Oct 25, 2012
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION A...
- Publication number 20120146229
- Publication date Jun 14, 2012
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED LEAD AND METHOD OF...
- Publication number 20120038040
- Publication date Feb 16, 2012
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUNDED INTERCONNECT
- Publication number 20120025374
- Publication date Feb 2, 2012
- JoHyun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...
- Publication number 20110233736
- Publication date Sep 29, 2011
- HyungSang Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...
- Publication number 20110233751
- Publication date Sep 29, 2011
- JoHyun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING SYSTEM WITH AN ALIGNED INTERCONNECT AND MET...
- Publication number 20110204508
- Publication date Aug 25, 2011
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND MET...
- Publication number 20110180935
- Publication date Jul 28, 2011
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION AND MET...
- Publication number 20110115098
- Publication date May 19, 2011
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FAN-IN PACKAGE AND METHOD...
- Publication number 20110062602
- Publication date Mar 17, 2011
- SeungYun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND MET...
- Publication number 20110057308
- Publication date Mar 10, 2011
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM
- Publication number 20090283889
- Publication date Nov 19, 2009
- Byoung Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING INTERPOSER
- Publication number 20090166834
- Publication date Jul 2, 2009
- STATS ChipPAC Ltd.
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUBSTRATE HAVING A...
- Publication number 20090108428
- Publication date Apr 30, 2009
- Flynn Carson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTI-CHIP MODULE
- Publication number 20090072375
- Publication date Mar 19, 2009
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION
- Publication number 20090001612
- Publication date Jan 1, 2009
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTABLE INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH ADHESIV...
- Publication number 20080157319
- Publication date Jul 3, 2008
- STATS ChipPAC Ltd.
- Jong-Woo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MOLD FLASH PREVENTION T...
- Publication number 20080150119
- Publication date Jun 26, 2008
- STATS ChipPAC Ltd.
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACERLESS SEMICONDUCTOR PACKAGE CHIP STACKING SYSTEM
- Publication number 20070268660
- Publication date Nov 22, 2007
- STATS ChipPAC Ltd.
- Seungyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP PACKAGE SYSTEM
- Publication number 20070235216
- Publication date Oct 11, 2007
- STATS ChipPAC Ltd.
- JoHyun Bae
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Integrated circuit packaging system with package stacking

Integrated circuit package system with multi-chip module

Integrated circuit packaging system with vertical interconnection a...

Integrated circuit packaging system with fan-in package and method...

Integrated circuit package system employing mold flash prevention t...

Integrated circuit packaging system with stack device

Integrated circuit packaging system with interposer and method of m...

Integrated circuit packaging system with vertical interconnects and...

Integrated circuit packaging system with encapsulation and method o...

Integrated circuit packaging system with encapsulation and method o...

Integrated circuit package system with dual side connection and met...

Semiconductor packaging system with an aligned interconnect and met...

Integrated circuit packaging system with rounded interconnect

Integrated circuit packaging system with stacked lead and method of...

Integrated circuit package system employing mold flash prevention t...

Integrated circuit packaging system with conductive pillars and met...

Mountable integrated circuit package system with substrate having a...

Integrated circuit packaging system with rounded interconnect and m...

Integrated circuit packaging system with conductive pillars and met...

Integrated circuit package system with dual side connection

Mountable integrated circuit package system with stacking interposer

Multichip package system

Mountable integrated circuit package-in-package system with adhesiv...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHO...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF M...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTS AND...

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MOLD FLASH PREVENTION T...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH VERTICAL INTERCONNECTION A...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED LEAD AND METHOD OF...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUNDED INTERCONNECT

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...

SEMICONDUCTOR PACKAGING SYSTEM WITH AN ALIGNED INTERCONNECT AND MET...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND MET...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION AND MET...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FAN-IN PACKAGE AND METHOD...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONDUCTIVE PILLARS AND MET...

INTEGRATED CIRCUIT PACKAGE SYSTEM

MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING INTERPOSER

MOUNTABLE INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUBSTRATE HAVING A...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTI-CHIP MODULE

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION

MOUNTABLE INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH ADHESIV...

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MOLD FLASH PREVENTION T...

SPACERLESS SEMICONDUCTOR PACKAGE CHIP STACKING SYSTEM

MULTICHIP PACKAGE SYSTEM