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Patents Applicationslast 30 patents

Information Patent Application
LOW PROFILE DIE TERMINAL WITH BALL DROP SOLDER
- Publication number 20250201748
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jomari Austria
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE WITH BOND PAD
- Publication number 20250201738
- Publication date Jun 19, 2025
- TEXAS INSTRUMENTS INCORPORATED
- JEFFREY SOLAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT COPPER WIRE BONDING ON NANOTWIN COPPER STRUCTURES
- Publication number 20250140735
- Publication date May 1, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Jomari AUSTRIA
- H01 - BASIC ELECTRIC ELEMENTS