Jon A. Casey

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device console with natural draft cooling
- Patent number 11,825,592
- Issue date Nov 21, 2023
- International Business Machines Corporation
- Kamal K. Sikka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mitigating moisture-driven degradation of features designed to prev...
- Patent number 11,569,181
- Issue date Jan 31, 2023
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polygon integrated circuit (IC) packaging
- Patent number 11,410,894
- Issue date Aug 9, 2022
- International Business Machines Corporation
- Charles L. Arvin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Direct bonded heterogeneous integration packaging structures
- Patent number 11,177,217
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fins for enhanced die communication
- Patent number 11,031,343
- Issue date Jun 8, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating moisture-driven degradation of features designed to prev...
- Patent number 10,892,233
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device console with natural draft cooling
- Patent number 10,834,808
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Paul F. Bodenweber
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Direct bonded heterogeneous integration packaging structures
- Patent number 10,580,738
- Issue date Mar 3, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under die surface mounted electrical elements
- Patent number 9,601,423
- Issue date Mar 21, 2017
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Managing interconnect electromigration effects
- Patent number 9,477,568
- Issue date Oct 25, 2016
- International Business Machines Corporation
- Malcolm S. Allen-Ware
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device console with natural draft cooling
- Patent number 9,226,426
- Issue date Dec 29, 2015
- International Business Machines Corporation
- Paul F. Bodenweber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Passivation layer surface topography modifications for improved int...
- Patent number 8,786,059
- Issue date Jul 22, 2014
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module system with removable socketed modules
- Patent number 8,680,670
- Issue date Mar 25, 2014
- International Business Machines Corporation
- Jon Alfred Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Achieving mechanical and thermal stability in a multi-chip package
- Patent number 8,421,217
- Issue date Apr 16, 2013
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passivation layer surface topography modifications for improved int...
- Patent number 8,236,615
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced thermal management for improved module reliability
- Patent number 8,214,658
- Issue date Jul 3, 2012
- International Business Machines Corporation
- Jon A. Casey
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Achieving mechanical and thermal stability in a multi-chip package
- Patent number 8,202,765
- Issue date Jun 19, 2012
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative coefficient of thermal expansion particles
- Patent number 8,119,206
- Issue date Feb 21, 2012
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- B32 - LAYERED PRODUCTS
Information Patent Grant
Tracking thermal mini-cycle stress
- Patent number 7,917,328
- Issue date Mar 29, 2011
- International Business Machines Corporation
- Jon A. Casey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor chips with crack stop regions for reducing crack prop...
- Patent number 7,875,502
- Issue date Jan 25, 2011
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Centrifugal method for filing high aspect ratio blind mirco vias po...
- Patent number 7,815,968
- Issue date Oct 19, 2010
- International Business Machines Corporation
- Gareth Hougham
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Semiconductor chips with crack stop regions for reducing crack prop...
- Patent number 7,732,932
- Issue date Jun 8, 2010
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative coefficient of thermal expansion particles and method of f...
- Patent number 7,579,069
- Issue date Aug 25, 2009
- International Business Machines Corporation
- Gareth Geoffrey Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Centrifugal method for filing high aspect ratio blind micro vias wi...
- Patent number 7,452,568
- Issue date Nov 18, 2008
- International Business Machines Corporation
- Gareth Hougham
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method and apparatus for filling vias
- Patent number 7,449,067
- Issue date Nov 11, 2008
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced via structure for organic module performance
- Patent number 7,312,523
- Issue date Dec 25, 2007
- International Business Machines Corporation
- Jean J. Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package repair process
- Patent number 7,294,909
- Issue date Nov 13, 2007
- International Business Machines Corporation
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Suspension for filling via holes in silicon and method for making t...
- Patent number 7,288,474
- Issue date Oct 30, 2007
- International Business Machines Corporation
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon chip carrier with conductive through-vias and method for fa...
- Patent number 7,276,787
- Issue date Oct 2, 2007
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suspension for filling via holes in silicon and method for making t...
- Patent number 7,202,154
- Issue date Apr 10, 2007
- International Business Machines Corporation
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTICOMPONENT MODULE DESIGN AND FABRICATION
- Publication number 20220308564
- Publication date Sep 29, 2022
- International Business Machines Corporation
- Kirk D. Peterson
- G05 - CONTROLLING REGULATING
Information Patent Application
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...
- Publication number 20210118819
- Publication date Apr 22, 2021
- International Business Machines Corporation
- SUSHUMNA IRUVANTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYGON INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20210074599
- Publication date Mar 11, 2021
- International Business Machines Corporation
- Charles L. Arvin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE CONSOLE WITH NATURAL DRAFT COOLING
- Publication number 20210022239
- Publication date Jan 21, 2021
- International Business Machines Corporation
- Kamal K. SIKKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FINS FOR ENHANCED DIE COMMUNICATION
- Publication number 20200402912
- Publication date Dec 24, 2020
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES
- Publication number 20200144187
- Publication date May 7, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...
- Publication number 20200135662
- Publication date Apr 30, 2020
- International Business Machines Corporation
- SUSHUMNA IRUVANTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES
- Publication number 20190295952
- Publication date Sep 26, 2019
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE CONSOLE WITH NATURAL DRAFT COOLING
- Publication number 20160021731
- Publication date Jan 21, 2016
- International Business Machines Corporation
- Paul F. BODENWEBER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Managing Interconnect Electromigration Effects
- Publication number 20150094995
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Malcolm S. Allen-Ware
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC DEVICE CONSOLE WITH NATURAL DRAFT COOLING
- Publication number 20140024465
- Publication date Jan 23, 2014
- International Business Machines Corporation
- Paul F. BODENWEBER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...
- Publication number 20120228748
- Publication date Sep 13, 2012
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF ACHIEVING MECHANICAL AND THERMAL STABILITY IN...
- Publication number 20120175766
- Publication date Jul 12, 2012
- International Business Machines Corporation
- Jon A. CASEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES
- Publication number 20120098116
- Publication date Apr 26, 2012
- International Business Machines Corporation
- Jon Alfred Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...
- Publication number 20110121469
- Publication date May 26, 2011
- International Business Machines Corporation
- Alexandre Blander
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS WITH CRACK STOP REGIONS FOR REDUCING CRACK PROP...
- Publication number 20100233872
- Publication date Sep 16, 2010
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method of Achieving Mechanical and Thermal Stability in...
- Publication number 20100181665
- Publication date Jul 22, 2010
- International Business Machines Corporation
- Jon A. CASEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced Thermal Management for Improved Module Reliability
- Publication number 20100049995
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Jon A. Casey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Tracking Thermal Mini-Cycle Stress
- Publication number 20100049466
- Publication date Feb 25, 2010
- International Business Machines Corporation
- Jon A. Casey
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Negative Coefficient of Thermal Expansion Particles and Method of F...
- Publication number 20090214780
- Publication date Aug 27, 2009
- International Business Machines
- Gareth Geoffrey Hougham
- B32 - LAYERED PRODUCTS
Information Patent Application
CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WI...
- Publication number 20090032962
- Publication date Feb 5, 2009
- International Business Machines Corporation (Yorktown)
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIPS WITH CRACK STOP REGIONS FOR REDUCING CRACK PROP...
- Publication number 20090032909
- Publication date Feb 5, 2009
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Suspension for filling via holes in silicon and method for making t...
- Publication number 20070032078
- Publication date Feb 8, 2007
- International Business Machines Corporation
- JON A. CASEY
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENHANCED VIA STRUCTURE FOR ORGANIC MODULE PERFORMANCE
- Publication number 20070023913
- Publication date Feb 1, 2007
- International Business Machines Corporation
- Jean J. Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MATERIALS AND METHOD TO SEAL VIAS IN SILICON SUBSTRATES
- Publication number 20060255480
- Publication date Nov 16, 2006
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Centrifugal method for filing high aspect ratio blind micro vias wi...
- Publication number 20060177568
- Publication date Aug 10, 2006
- International Business Machines Corporation
- Gareth Hougham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Silicon chip carrier with conductive through-vias and method for fa...
- Publication number 20060027934
- Publication date Feb 9, 2006
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-k dielectric material system for IC application
- Publication number 20050200025
- Publication date Sep 15, 2005
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package repair process
- Publication number 20050176255
- Publication date Aug 11, 2005
- Jon A. Casey
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND STRUCTURE FOR INTEGRATING THERMISTOR
- Publication number 20050151213
- Publication date Jul 14, 2005
- International Business Machines Corporation
- Jon A. Casey
- G01 - MEASURING TESTING

Jon A. Casey

Person

Patents Grantslast 30 patents

Electronic device console with natural draft cooling

Mitigating moisture-driven degradation of features designed to prev...

Polygon integrated circuit (IC) packaging

Direct bonded heterogeneous integration packaging structures

Fins for enhanced die communication

Mitigating moisture-driven degradation of features designed to prev...

Electronic device console with natural draft cooling

Direct bonded heterogeneous integration packaging structures

Under die surface mounted electrical elements

Managing interconnect electromigration effects

Electronic device console with natural draft cooling

Passivation layer surface topography modifications for improved int...

Multi-chip module system with removable socketed modules

Achieving mechanical and thermal stability in a multi-chip package

Passivation layer surface topography modifications for improved int...

Enhanced thermal management for improved module reliability

Achieving mechanical and thermal stability in a multi-chip package

Negative coefficient of thermal expansion particles

Tracking thermal mini-cycle stress

Semiconductor chips with crack stop regions for reducing crack prop...

Centrifugal method for filing high aspect ratio blind mirco vias po...

Semiconductor chips with crack stop regions for reducing crack prop...

Negative coefficient of thermal expansion particles and method of f...

Centrifugal method for filing high aspect ratio blind micro vias wi...

Method and apparatus for filling vias

Enhanced via structure for organic module performance

Electronic package repair process

Suspension for filling via holes in silicon and method for making t...

Silicon chip carrier with conductive through-vias and method for fa...

Suspension for filling via holes in silicon and method for making t...

Patents Applicationslast 30 patents

MULTICOMPONENT MODULE DESIGN AND FABRICATION

MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...

POLYGON INTEGRATED CIRCUIT (IC) PACKAGING

ELECTRONIC DEVICE CONSOLE WITH NATURAL DRAFT COOLING

FINS FOR ENHANCED DIE COMMUNICATION

DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES

MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...

DIRECT BONDED HETEROGENEOUS INTEGRATION PACKAGING STRUCTURES

ELECTRONIC DEVICE CONSOLE WITH NATURAL DRAFT COOLING

Managing Interconnect Electromigration Effects

ELECTRONIC DEVICE CONSOLE WITH NATURAL DRAFT COOLING

PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...

SYSTEM AND METHOD OF ACHIEVING MECHANICAL AND THERMAL STABILITY IN...

MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES

PASSIVATION LAYER SURFACE TOPOGRAPHY MODIFICATIONS FOR IMPROVED INT...

SEMICONDUCTOR CHIPS WITH CRACK STOP REGIONS FOR REDUCING CRACK PROP...

System and Method of Achieving Mechanical and Thermal Stability in...

Enhanced Thermal Management for Improved Module Reliability

Tracking Thermal Mini-Cycle Stress

Negative Coefficient of Thermal Expansion Particles and Method of F...

CENTRIFUGAL METHOD FOR FILING HIGH ASPECT RATIO BLIND MICRO VIAS WI...

SEMICONDUCTOR CHIPS WITH CRACK STOP REGIONS FOR REDUCING CRACK PROP...

Suspension for filling via holes in silicon and method for making t...

ENHANCED VIA STRUCTURE FOR ORGANIC MODULE PERFORMANCE

MATERIALS AND METHOD TO SEAL VIAS IN SILICON SUBSTRATES

Centrifugal method for filing high aspect ratio blind micro vias wi...

Silicon chip carrier with conductive through-vias and method for fa...

Low-k dielectric material system for IC application

Electronic package repair process

METHOD AND STRUCTURE FOR INTEGRATING THERMISTOR