Jon B. DCamp

Person

Savage, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Getter on die in an upper sense plate designed system
- Patent number 7,800,190
- Issue date Sep 21, 2010
- Honeywell International Inc.
- Bryan Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
System and method for sealing a MEMS device
- Patent number 7,736,946
- Issue date Jun 15, 2010
- Honeywell International Inc.
- Bryan R. Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dicing technique for flip-chip USP wafers
- Patent number 7,491,581
- Issue date Feb 17, 2009
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device packaging methods
- Patent number 7,491,567
- Issue date Feb 17, 2009
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Injection-molded package for MEMS inertial sensor
- Patent number 7,482,193
- Issue date Jan 27, 2009
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package for MEMS devices
- Patent number 7,370,530
- Issue date May 13, 2008
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip packaging systems and methods
- Patent number 7,314,777
- Issue date Jan 1, 2008
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for particle reduction in MEMS devices
- Patent number 7,297,573
- Issue date Nov 20, 2007
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for attaching getters to MEMS device housings
- Patent number 7,074,636
- Issue date Jul 11, 2006
- Honeywell International Inc.
- Harlan L. Curtis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for attaching a die to a substrate
- Patent number 7,037,805
- Issue date May 2, 2006
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for particle reduction in MEMS devices
- Patent number 6,987,304
- Issue date Jan 17, 2006
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for attaching MEMS devices to housing
- Patent number 6,927,098
- Issue date Aug 9, 2005
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for attaching getters to MEMS device housings
- Patent number 6,914,323
- Issue date Jul 5, 2005
- Honeywell International Inc.
- Harlan L. Curtis
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS SENSOR WITH INTEGRATED ASIC PACKAGING
- Publication number 20110227173
- Publication date Sep 22, 2011
- Honeywell International Inc.
- Bryan R. Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS BUMP PATTERN DIE ALIGNMENT SYSTEMS AND METHODS
- Publication number 20100020517
- Publication date Jan 28, 2010
- Honeywell International Inc.
- Bryan Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
GETTER ON DIE IN AN UPPER SENSE PLATE DESIGNED SYSTEM
- Publication number 20090309203
- Publication date Dec 17, 2009
- Honeywell International Inc.
- Bryan Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
AUTOMATED PREFORM ATTACH FOR VACUUM PACKAGING
- Publication number 20090014499
- Publication date Jan 15, 2009
- Honeywell International Inc.
- Bryan R. Seppala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR SEALING A MEMS DEVICE
- Publication number 20080188035
- Publication date Aug 7, 2008
- Honeywell International Inc.
- Bryan R. Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DICING TECHNIQUE FOR FLIP-CHIP USP WAFERS
- Publication number 20080150160
- Publication date Jun 26, 2008
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Chip Packaging Systems and Methods
- Publication number 20080063505
- Publication date Mar 13, 2008
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE PACKAGING METHODS
- Publication number 20070117275
- Publication date May 24, 2007
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS FLIP-CHIP PACKAGING
- Publication number 20070114643
- Publication date May 24, 2007
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Getter deposition for vacuum packaging
- Publication number 20060214247
- Publication date Sep 28, 2006
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Injection-molded package for MEMS inertial sensor
- Publication number 20060134825
- Publication date Jun 22, 2006
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Chip packaging systems and methods
- Publication number 20060105499
- Publication date May 18, 2006
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and apparatus for particle reduction in MEMS devices
- Publication number 20060076633
- Publication date Apr 13, 2006
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package for MEMS devices
- Publication number 20060042382
- Publication date Mar 2, 2006
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Getter deposition for vacuum packaging
- Publication number 20050253283
- Publication date Nov 17, 2005
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and apparatus for attaching getters to MEMS device housings
- Publication number 20050208739
- Publication date Sep 22, 2005
- Harlan L. Curtis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and apparatus for attaching a die to a substrate
- Publication number 20040232455
- Publication date Nov 25, 2004
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and apparatus for attaching MEMS devices to housing
- Publication number 20040223373
- Publication date Nov 11, 2004
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and apparatus for particle reduction in MEMS devices
- Publication number 20040222468
- Publication date Nov 11, 2004
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and apparatus for attaching getters to MEMS device housings
- Publication number 20040183177
- Publication date Sep 23, 2004
- Harlan L. Curtis
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Jon B. DCamp

Person

Patents Grantslast 30 patents

Getter on die in an upper sense plate designed system

System and method for sealing a MEMS device

Dicing technique for flip-chip USP wafers

MEMS device packaging methods

Injection-molded package for MEMS inertial sensor

Package for MEMS devices

Chip packaging systems and methods

Methods and apparatus for particle reduction in MEMS devices

Methods and apparatus for attaching getters to MEMS device housings

Methods and apparatus for attaching a die to a substrate

Methods and apparatus for particle reduction in MEMS devices

Methods and apparatus for attaching MEMS devices to housing

Methods and apparatus for attaching getters to MEMS device housings

Patents Applicationslast 30 patents

MEMS SENSOR WITH INTEGRATED ASIC PACKAGING

MEMS BUMP PATTERN DIE ALIGNMENT SYSTEMS AND METHODS

GETTER ON DIE IN AN UPPER SENSE PLATE DESIGNED SYSTEM

AUTOMATED PREFORM ATTACH FOR VACUUM PACKAGING

SYSTEM AND METHOD FOR SEALING A MEMS DEVICE

DICING TECHNIQUE FOR FLIP-CHIP USP WAFERS

Chip Packaging Systems and Methods

MEMS DEVICE PACKAGING METHODS

MEMS FLIP-CHIP PACKAGING

Getter deposition for vacuum packaging

Injection-molded package for MEMS inertial sensor

Chip packaging systems and methods

Methods and apparatus for particle reduction in MEMS devices

Package for MEMS devices

Getter deposition for vacuum packaging

Methods and apparatus for attaching getters to MEMS device housings

Methods and apparatus for attaching a die to a substrate

Methods and apparatus for attaching MEMS devices to housing

Methods and apparatus for particle reduction in MEMS devices

Methods and apparatus for attaching getters to MEMS device housings