Jon G. Aday

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor module package substrate fabrication method
- Patent number 6,494,361
- Issue date Dec 17, 2002
- Amkor Technology, Inc.
- Christopher Scanlan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module package substrate
- Patent number 6,445,075
- Issue date Sep 3, 2002
- Amkor Technology, Inc.
- Christopher Scanlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface acoustic wave device package and method
- Patent number 5,969,461
- Issue date Oct 19, 1999
- CTS Corporation
- Michael J. Anderson
- H03 - BASIC ELECTRONIC CIRCUITRY