Jon Hacker

Person

Meridian, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 11,955,346
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform electrochemical plating of metal onto arrays of pillars hav...
- Patent number 11,923,329
- Issue date Mar 5, 2024
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for forming semiconductor cutting/trimming blades
- Patent number 11,565,371
- Issue date Jan 31, 2023
- Micron Technology, Inc.
- Jonathan S. Hacker
- B24 - GRINDING POLISHING
Information Patent Grant
Uniform electrochemical plating of metal onto arrays of pillars hav...
- Patent number 11,527,505
- Issue date Dec 13, 2022
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Inductive testing probe apparatus for testing semiconductor die and...
- Patent number 11,402,426
- Issue date Aug 2, 2022
- Micron Technology, Inc.
- Tony M. Lindenberg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die features for self-alignment during die bonding
- Patent number 11,302,653
- Issue date Apr 12, 2022
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Edge cut debond using a temporary filler material with no adhesive...
- Patent number 11,094,684
- Issue date Aug 17, 2021
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 11,004,697
- Issue date May 11, 2021
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having discretely located passivation materia...
- Patent number 10,896,886
- Issue date Jan 19, 2021
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive testing probe apparatus for testing semiconductor die and...
- Patent number 10,852,344
- Issue date Dec 1, 2020
- Micron Technology, Inc.
- Tony M. Lindenberg
- G01 - MEASURING TESTING
Information Patent Grant
Uniform electrochemical plating of metal onto arrays of pillars hav...
- Patent number 10,847,486
- Issue date Nov 24, 2020
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 10,763,131
- Issue date Sep 1, 2020
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die features for self-alignment during die bonding
- Patent number 10,748,857
- Issue date Aug 18, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a multi-layered encapsulant and associate...
- Patent number 10,622,223
- Issue date Apr 14, 2020
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary carrier debond initiation, and associated systems and met...
- Patent number 10,446,431
- Issue date Oct 15, 2019
- Micron Technology, Inc.
- Jonathan S. Hacker
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Edge cut debond using a temporary filler material with no adhesive...
- Patent number 10,403,618
- Issue date Sep 3, 2019
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform electrochemical plating of metal onto arrays of pillars hav...
- Patent number 10,396,052
- Issue date Aug 27, 2019
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices having discretely located passivation materia...
- Patent number 10,262,961
- Issue date Apr 16, 2019
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing multi-die semiconductor device packages an...
- Patent number 10,103,134
- Issue date Oct 16, 2018
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having discretely located passivation materia...
- Patent number 10,002,840
- Issue date Jun 19, 2018
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Uniform electrochemical plating of metal onto arrays of pillars hav...
- Patent number 9,905,527
- Issue date Feb 27, 2018
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods of manufacturing multi-die semiconductor device packages an...
- Patent number 9,865,578
- Issue date Jan 9, 2018
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for backside photo alignment
- Patent number 9,741,612
- Issue date Aug 22, 2017
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for backside photo alignment
- Patent number 9,299,663
- Issue date Mar 29, 2016
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20240222145
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...
- Publication number 20240178175
- Publication date May 30, 2024
- Lodestar Licensing Group LLC
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...
- Publication number 20230104042
- Publication date Apr 6, 2023
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20210257226
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...
- Publication number 20210074663
- Publication date Mar 11, 2021
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INDUCTIVE TESTING PROBE APPARATUS FOR TESTING SEMICONDUCTOR DIE AND...
- Publication number 20210041495
- Publication date Feb 11, 2021
- Micron Technology, Inc.
- Tony M. Lindenberg
- G01 - MEASURING TESTING
Information Patent Application
Die Features for Self-Alignment During Die Bonding
- Publication number 20200373252
- Publication date Nov 26, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FORMING SEMICONDUCTOR CUTTING/TRIMMING BLADES
- Publication number 20200206869
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Jonathan S. Hacker
- B24 - GRINDING POLISHING
Information Patent Application
Die Features for Self-Alignment During Die Bonding
- Publication number 20200083178
- Publication date Mar 12, 2020
- Micron Technology, Inc.
- Bret K. Street
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...
- Publication number 20190385967
- Publication date Dec 19, 2019
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Edge Cut Debond Using a Temporary Filler Material With No Adhesive...
- Publication number 20190341378
- Publication date Nov 7, 2019
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20190311918
- Publication date Oct 10, 2019
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY CARRIER DEBOND INITIATION, AND ASSOCIATED SYSTEMS AND MET...
- Publication number 20190198377
- Publication date Jun 27, 2019
- Micron Technology, Inc.
- Jonathan S. Hacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING DISCRETELY LOCATED PASSIVATION MATERIA...
- Publication number 20190189576
- Publication date Jun 20, 2019
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTIVE TESTING PROBE APPARATUS FOR TESTING SEMICONDUCTOR DIE AND...
- Publication number 20190178933
- Publication date Jun 13, 2019
- Micron Technology, Inc.
- Tony M. Lindenberg
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20190157112
- Publication date May 23, 2019
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...
- Publication number 20190157111
- Publication date May 23, 2019
- Micron Technology, Inc.
- Shijian Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Edge Cut Debond Using a Temporary Filler Material With No Adhesive...
- Publication number 20190088637
- Publication date Mar 21, 2019
- Micron Technology, Inc.
- Chandra S. Tiwari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING DISCRETELY LOCATED PASSIVATION MATERIA...
- Publication number 20190051623
- Publication date Feb 14, 2019
- Micron Technology, Inc.
- Mayukhee Das
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...
- Publication number 20180174993
- Publication date Jun 21, 2018
- Micron Technology, Inc.
- Jonathan S. Hacker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICE PACKAGES AN...
- Publication number 20180033781
- Publication date Feb 1, 2018
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING MULTI DIE SEMICONDUCTOR DEVICE PACKAGES AN...
- Publication number 20160358898
- Publication date Dec 8, 2016
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT
- Publication number 20160172242
- Publication date Jun 16, 2016
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT
- Publication number 20150333014
- Publication date Nov 19, 2015
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device with a multi-layered encapsulant and associate...

Uniform electrochemical plating of metal onto arrays of pillars hav...

Systems and methods for forming semiconductor cutting/trimming blades

Uniform electrochemical plating of metal onto arrays of pillars hav...

Inductive testing probe apparatus for testing semiconductor die and...

Die features for self-alignment during die bonding

Edge cut debond using a temporary filler material with no adhesive...

Semiconductor device with a multi-layered encapsulant and associate...

Semiconductor devices having discretely located passivation materia...

Inductive testing probe apparatus for testing semiconductor die and...

Uniform electrochemical plating of metal onto arrays of pillars hav...

Semiconductor device with a multi-layered encapsulant and associate...

Die features for self-alignment during die bonding

Semiconductor device with a multi-layered encapsulant and associate...

Temporary carrier debond initiation, and associated systems and met...

Edge cut debond using a temporary filler material with no adhesive...

Uniform electrochemical plating of metal onto arrays of pillars hav...

Semiconductor devices having discretely located passivation materia...

Methods of manufacturing multi-die semiconductor device packages an...

Semiconductor devices having discretely located passivation materia...

Uniform electrochemical plating of metal onto arrays of pillars hav...

Methods of manufacturing multi-die semiconductor device packages an...

Semiconductor devices and methods for backside photo alignment

Semiconductor devices and methods for backside photo alignment

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...

UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...

INDUCTIVE TESTING PROBE APPARATUS FOR TESTING SEMICONDUCTOR DIE AND...

Die Features for Self-Alignment During Die Bonding

SYSTEMS AND METHODS FOR FORMING SEMICONDUCTOR CUTTING/TRIMMING BLADES

Die Features for Self-Alignment During Die Bonding

UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...

Edge Cut Debond Using a Temporary Filler Material With No Adhesive...

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

TEMPORARY CARRIER DEBOND INITIATION, AND ASSOCIATED SYSTEMS AND MET...

SEMICONDUCTOR DEVICES HAVING DISCRETELY LOCATED PASSIVATION MATERIA...

INDUCTIVE TESTING PROBE APPARATUS FOR TESTING SEMICONDUCTOR DIE AND...

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

SEMICONDUCTOR DEVICE WITH A MULTI-LAYERED ENCAPSULANT AND ASSOCIATE...

Edge Cut Debond Using a Temporary Filler Material With No Adhesive...

SEMICONDUCTOR DEVICES HAVING DISCRETELY LOCATED PASSIVATION MATERIA...

UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAV...

METHODS OF MANUFACTURING MULTI-DIE SEMICONDUCTOR DEVICE PACKAGES AN...

METHODS OF MANUFACTURING MULTI DIE SEMICONDUCTOR DEVICE PACKAGES AN...

SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT

SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT