Jonas G. Croissant

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Hillsboro, OR, US

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Patents Applicationslast 30 patents

Information Patent Application
BARRIER DISPENSING COMBINED WITH NON-CONDUCTIVE PASTE TO ENABLE PAC...
- Publication number 20240321807
- Publication date Sep 26, 2024
- Intel Corporation
- Jonas CROISSANT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER ENABLED CUF AND MOLD PROCESS FOR MULTI-CHIP PACKAGING
- Publication number 20240153837
- Publication date May 9, 2024
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER FOR MINIMAL UNDERFILL KEEP-OUT ZONES
- Publication number 20240006312
- Publication date Jan 4, 2024
- Intel Corporation
- Xavier F. Brun
- H01 - BASIC ELECTRIC ELEMENTS