Jonathan A. Noquil

Person

Surigao del Sur Philippines, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Thermally enhanced low parasitic power semiconductor package
- Patent number 8,354,303
- Issue date Jan 15, 2013
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side cooling integrated power device module and methods of man...
- Patent number 8,198,134
- Issue date Jun 12, 2012
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip MLP with folded heat sink
- Patent number 8,119,457
- Issue date Feb 21, 2012
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of assembly thereof
- Patent number 8,049,312
- Issue date Nov 1, 2011
- Texas Instruments Incorporated
- Juan Alejandro Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated transistor module and method of fabricating same
- Patent number 7,842,555
- Issue date Nov 30, 2010
- Fairchild Semiconductor Corporation
- Rajeev D. Joshi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Flip chip MLP with folded heat sink
- Patent number 7,812,437
- Issue date Oct 12, 2010
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side cooling integrated power device module and methods of man...
- Patent number 7,777,315
- Issue date Aug 17, 2010
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate based unmolded package
- Patent number 7,682,877
- Issue date Mar 23, 2010
- Fairchild Semiconductor Corporation
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side cooling integrated power device package and module with a...
- Patent number 7,663,211
- Issue date Feb 16, 2010
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated transistor module and method of fabricating same
- Patent number 7,501,702
- Issue date Mar 10, 2009
- Fairchild Semiconductor Corporation
- Rajeev D. Joshi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Substrate based unmolded package
- Patent number 7,439,613
- Issue date Oct 21, 2008
- Fairchild Semicondcutor Corporation
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembly for multi-flip chip on lead frame on overmolded...
- Patent number 7,335,532
- Issue date Feb 26, 2008
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to manufacture a universal footprint for a package with expo...
- Patent number 7,256,479
- Issue date Aug 14, 2007
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor die package including carrier with mask and semicondu...
- Patent number 7,157,799
- Issue date Jan 2, 2007
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-flip chip on lead frame on over molded IC package and method...
- Patent number 7,154,186
- Issue date Dec 26, 2006
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package including carrier with mask
- Patent number 6,645,791
- Issue date Nov 11, 2003
- Fairchild Semiconductor
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High Frequency Power Supply Module Having High Efficiency and High...
- Publication number 20110210708
- Publication date Sep 1, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Juan A. HERBSOMMER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE COOLING INTEGRATED POWER DEVICE MODULE AND METHODS OF MAN...
- Publication number 20110008933
- Publication date Jan 13, 2011
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP MLP WITH FOLDED HEAT SINK
- Publication number 20110003432
- Publication date Jan 6, 2011
- Fairchild Semiconductor Corporation
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF ASSEMBLY THEREOF
- Publication number 20100176508
- Publication date Jul 15, 2010
- CICLON SEMICONDUCTOR DEVICE CORP.
- Juan Alejandro Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED TRANSISTOR MODULE AND METHOD OF FABRICATING SAME
- Publication number 20090117690
- Publication date May 7, 2009
- Rajeev D. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BASED UNMOLDED PACKAGE
- Publication number 20080213946
- Publication date Sep 4, 2008
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE COOLING INTEGRATED POWER DEVICE PACKAGE AND MODULE AND ME...
- Publication number 20080023807
- Publication date Jan 31, 2008
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE COOLING INTEGRATED POWER DEVICE MODULE AND METHODS OF MAN...
- Publication number 20070267726
- Publication date Nov 22, 2007
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP MLP WITH FOLDED HEAT SINK
- Publication number 20070267728
- Publication date Nov 22, 2007
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLY FOR MULTI-FLIP CHIP ON LEAD FRAME ON OVERMOLDED...
- Publication number 20070072347
- Publication date Mar 29, 2007
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reversible-multiple footprint package and method of manufacturing
- Publication number 20070045785
- Publication date Mar 1, 2007
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to manufacture a universal footprint for a package with expo...
- Publication number 20060151861
- Publication date Jul 13, 2006
- Jonathan A. Noquil
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Integrated transistor module and method of fabricating same
- Publication number 20050285238
- Publication date Dec 29, 2005
- Rajeev D. Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-flip chip on lead frame on over molded IC package and method...
- Publication number 20050206010
- Publication date Sep 22, 2005
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate based unmolded package
- Publication number 20040207052
- Publication date Oct 21, 2004
- Rajeev Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die package including carrier with mask
- Publication number 20030205798
- Publication date Nov 6, 2003
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor die package including carrier with mask
- Publication number 20020155642
- Publication date Oct 24, 2002
- Jonathan A. Noquil
- H01 - BASIC ELECTRIC ELEMENTS

Jonathan A. Noquil

Person

Patents Grantslast 30 patents

Thermally enhanced low parasitic power semiconductor package

Dual side cooling integrated power device module and methods of man...

Flip chip MLP with folded heat sink

Semiconductor device package and method of assembly thereof

Integrated transistor module and method of fabricating same

Flip chip MLP with folded heat sink

Dual side cooling integrated power device module and methods of man...

Substrate based unmolded package

Dual side cooling integrated power device package and module with a...

Integrated transistor module and method of fabricating same

Substrate based unmolded package

Method of assembly for multi-flip chip on lead frame on overmolded...

Method to manufacture a universal footprint for a package with expo...

Semiconductor die package including carrier with mask and semicondu...

Multi-flip chip on lead frame on over molded IC package and method...

Semiconductor die package including carrier with mask

Patents Applicationslast 30 patents

High Frequency Power Supply Module Having High Efficiency and High...

DUAL SIDE COOLING INTEGRATED POWER DEVICE MODULE AND METHODS OF MAN...

FLIP CHIP MLP WITH FOLDED HEAT SINK

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF ASSEMBLY THEREOF

INTEGRATED TRANSISTOR MODULE AND METHOD OF FABRICATING SAME

SUBSTRATE BASED UNMOLDED PACKAGE

DUAL SIDE COOLING INTEGRATED POWER DEVICE PACKAGE AND MODULE AND ME...

DUAL SIDE COOLING INTEGRATED POWER DEVICE MODULE AND METHODS OF MAN...

FLIP CHIP MLP WITH FOLDED HEAT SINK

METHOD OF ASSEMBLY FOR MULTI-FLIP CHIP ON LEAD FRAME ON OVERMOLDED...

Reversible-multiple footprint package and method of manufacturing

Method to manufacture a universal footprint for a package with expo...

Integrated transistor module and method of fabricating same

Multi-flip chip on lead frame on over molded IC package and method...

Substrate based unmolded package

Semiconductor die package including carrier with mask

Semiconductor die package including carrier with mask