Jonathan Almeria Noquil

Person

Bethlehem, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 12,243,809
- Issue date Mar 4, 2025
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die package with multiple heat channels
- Patent number 12,176,274
- Issue date Dec 24, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly
- Patent number 12,148,556
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die multichip module package
- Patent number 12,015,019
- Issue date Jun 18, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relief for flip-chip packaged devices
- Patent number 11,930,590
- Issue date Mar 12, 2024
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,908,780
- Issue date Feb 20, 2024
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High I/O density flip-chip QFN
- Patent number 11,817,375
- Issue date Nov 14, 2023
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metal layer in power packages
- Patent number 11,784,114
- Issue date Oct 10, 2023
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive plate stress reduction feature
- Patent number 11,658,130
- Issue date May 23, 2023
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 11,640,932
- Issue date May 2, 2023
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 11,177,246
- Issue date Nov 16, 2021
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with solder standoff
- Patent number 11,177,197
- Issue date Nov 16, 2021
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die multichip module package
- Patent number 11,081,472
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter monolithically integrating transistors, carrier, an...
- Patent number 11,043,477
- Issue date Jun 22, 2021
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Packaged electronic device with film isolated power stack
- Patent number 11,024,564
- Issue date Jun 1, 2021
- Texas Instruments Incorporated
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having terminals directly attachable to circui...
- Patent number 10,930,582
- Issue date Feb 23, 2021
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power unit with an integrated pull-down transistor
- Patent number 10,826,487
- Issue date Nov 3, 2020
- Texas Instruments Incorporated
- Haian Lin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 10,438,936
- Issue date Oct 8, 2019
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe inductor
- Patent number 10,396,016
- Issue date Aug 27, 2019
- Texas Instruments Incorporated
- Joyce Marie Mullenix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package having electrical functionality by embedded passive...
- Patent number 10,153,220
- Issue date Dec 11, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package for embedded semiconductor chip and power converter
- Patent number 10,121,716
- Issue date Nov 6, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package for embedded electronic system having stacked semic...
- Patent number 10,109,614
- Issue date Oct 23, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package for embedded semiconductor chip and power converter
- Patent number 10,062,624
- Issue date Aug 28, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power converter monolithically integrating transistors, carrier, an...
- Patent number 10,050,025
- Issue date Aug 14, 2018
- Texas Instruments Incorporated
- Jonathan Almeria Noquil
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Multi-chip module clips with connector bar
- Patent number 9,935,041
- Issue date Apr 3, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photo-sensitive silicon package embedding self-powered electronic s...
- Patent number 9,859,261
- Issue date Jan 2, 2018
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package having electrical functionality by embedded passive...
- Patent number 9,818,662
- Issue date Nov 14, 2017
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin power transistor and synchronous buck converter having c...
- Patent number 9,779,967
- Issue date Oct 3, 2017
- Texas Instruments Incorporated
- Juan A Herbsommer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon package for embedded semiconductor chip and power converter
- Patent number 9,721,860
- Issue date Aug 1, 2017
- Texas Instruments Incorporated
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating multi-output power converters having vertically stacked...
- Patent number 9,653,388
- Issue date May 16, 2017
- Texas Instruments Incorporated
- Marie Denison
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT WITH A PROTECTIVE LAYER
- Publication number 20250233036
- Publication date Jul 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- GUANGXU LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC LAYERS IN MAGNETIC MOLD COMPOUND INDUCTOR PACKAGES
- Publication number 20250126813
- Publication date Apr 17, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Sylvester ANKAMAH-KUSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INDUCTOR MODULE AND PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20240429216
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING DEPRESSION
- Publication number 20240222207
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Michael LUEDERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
- Publication number 20240224415
- Publication date Jul 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED METAL LAYER IN POWER PACKAGES
- Publication number 20240047330
- Publication date Feb 8, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria NOQUIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONICS DEVICE PACKAGE AND METHODS
- Publication number 20230411262
- Publication date Dec 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT
- Publication number 20230378146
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- John Carlo Molina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Electronic Device With Film Isolated Power Stack
- Publication number 20230268253
- Publication date Aug 24, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILEVEL PACKAGE SUBSTRATE DEVICE WITH BGA PIN OUT AND COAXIAL SI...
- Publication number 20230063343
- Publication date Mar 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Rajen Manicon Murugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES
- Publication number 20220210911
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PLATE STRESS REDUCTION FEATURE
- Publication number 20220208692
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLATED METAL LAYER IN POWER PACKAGES
- Publication number 20220181241
- Publication date Jun 9, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria NOQUIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF
- Publication number 20220115308
- Publication date Apr 14, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED MAGNETIC ASSEMBLY
- Publication number 20220028593
- Publication date Jan 27, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Die Multichip Module Package
- Publication number 20210320093
- Publication date Oct 14, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Electronic Device With Film Isolated Power Stack
- Publication number 20210265246
- Publication date Aug 26, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF
- Publication number 20210090980
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE MULTICHIP MODULE PACKAGE
- Publication number 20210082889
- Publication date Mar 18, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICE WITH FILM ISOLATED POWER STACK
- Publication number 20200402894
- Publication date Dec 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Tianyi Luo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH I/O DENSITY FLIP-CHIP QFN
- Publication number 20200258822
- Publication date Aug 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge LOPEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE WITH MULTIPLE HEAT CHANNELS
- Publication number 20200168533
- Publication date May 28, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria NOQUIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...
- Publication number 20190385992
- Publication date Dec 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER UNIT WITH AN INTEGRATED PULL-DOWN TRANSISTOR
- Publication number 20190173464
- Publication date Jun 6, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Haian Lin
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Power Converter Monolithically Integrating Transistors, Carrier, an...
- Publication number 20180331083
- Publication date Nov 15, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Jonathan Almeria Noquil
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
LEADFRAME INDUCTOR
- Publication number 20180190573
- Publication date Jul 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- JOYCE MARIE MULLENIX
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photo-Sensitive Silicon Package Embedding Self-Powered Electronic S...
- Publication number 20180096978
- Publication date Apr 5, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PACKAGE HAVING ELECTRICAL FUNCTIONALITY BY EMBEDDED PASSIVE...
- Publication number 20180040527
- Publication date Feb 8, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER
- Publication number 20170301595
- Publication date Oct 19, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER
- Publication number 20170301596
- Publication date Oct 19, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Jorge Lopez
- H01 - BASIC ELECTRIC ELEMENTS

Jonathan Almeria Noquil

Person

Patents Grantslast 30 patents

Packaged electronic device with film isolated power stack

Multi-die package with multiple heat channels

Integrated magnetic assembly

Stacked die multichip module package

Stress relief for flip-chip packaged devices

Semiconductor package with solder standoff

High I/O density flip-chip QFN

Plated metal layer in power packages

Conductive plate stress reduction feature

Packaged electronic device with film isolated power stack

Photo-sensitive silicon package embedding self-powered electronic s...

Semiconductor package with solder standoff

Stacked die multichip module package

Power converter monolithically integrating transistors, carrier, an...

Packaged electronic device with film isolated power stack

Semiconductor device having terminals directly attachable to circui...

Power unit with an integrated pull-down transistor

Photo-sensitive silicon package embedding self-powered electronic s...

Leadframe inductor

Silicon package having electrical functionality by embedded passive...

Silicon package for embedded semiconductor chip and power converter

Silicon package for embedded electronic system having stacked semic...

Silicon package for embedded semiconductor chip and power converter

Power converter monolithically integrating transistors, carrier, an...

Multi-chip module clips with connector bar

Photo-sensitive silicon package embedding self-powered electronic s...

Silicon package having electrical functionality by embedded passive...

Ultra-thin power transistor and synchronous buck converter having c...

Silicon package for embedded semiconductor chip and power converter

Integrating multi-output power converters having vertically stacked...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT WITH A PROTECTIVE LAYER

DIELECTRIC LAYERS IN MAGNETIC MOLD COMPOUND INDUCTOR PACKAGES

EMBEDDED INDUCTOR MODULE AND PACKAGED SEMICONDUCTOR DEVICE

PACKAGE SUBSTRATE HAVING DEPRESSION

STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES

PLATED METAL LAYER IN POWER PACKAGES

MICROELECTRONICS DEVICE PACKAGE AND METHODS

MICROELECTRONIC DEVICE PACKAGE WITH INTEGRAL PASSIVE COMPONENT

Packaged Electronic Device With Film Isolated Power Stack

MULTILEVEL PACKAGE SUBSTRATE DEVICE WITH BGA PIN OUT AND COAXIAL SI...

STRESS RELIEF FOR FLIP-CHIP PACKAGED DEVICES

CONDUCTIVE PLATE STRESS REDUCTION FEATURE

PLATED METAL LAYER IN POWER PACKAGES

SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF

INTEGRATED MAGNETIC ASSEMBLY

Stacked Die Multichip Module Package

Packaged Electronic Device With Film Isolated Power Stack

SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF

STACKED DIE MULTICHIP MODULE PACKAGE

PACKAGED ELECTRONIC DEVICE WITH FILM ISOLATED POWER STACK

HIGH I/O DENSITY FLIP-CHIP QFN

MULTI-DIE PACKAGE WITH MULTIPLE HEAT CHANNELS

PHOTO-SENSITIVE SILICON PACKAGE EMBEDDING SELF-POWERED ELECTRONIC S...

POWER UNIT WITH AN INTEGRATED PULL-DOWN TRANSISTOR

Power Converter Monolithically Integrating Transistors, Carrier, an...

LEADFRAME INDUCTOR

Photo-Sensitive Silicon Package Embedding Self-Powered Electronic S...

SILICON PACKAGE HAVING ELECTRICAL FUNCTIONALITY BY EMBEDDED PASSIVE...

SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER

SILICON PACKAGE FOR EMBEDDED SEMICONDUCTOR CHIP AND POWER CONVERTER