Jonathan Clark

Person

Camarillo, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Single-shot encapsulation
- Patent number 12,166,001
- Issue date Dec 10, 2024
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,881,476
- Issue date Jan 23, 2024
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for electrical overstress and electrostatic disch...
- Patent number 11,380,672
- Issue date Jul 5, 2022
- Semtech Corporation
- David J. Rose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die for s...
- Patent number 11,373,990
- Issue date Jun 28, 2022
- Semtech Corporation
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 11,171,099
- Issue date Nov 9, 2021
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for electrical overstress and electrostatic disch...
- Patent number 10,692,854
- Issue date Jun 23, 2020
- Semtech Corporation
- David J. Rose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient voltage suppression diodes with reduced harmonics, and me...
- Patent number 10,510,741
- Issue date Dec 17, 2019
- Semtech Corporation
- Maykel Ghorbanzadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single-shot encapsulation
- Patent number 10,410,988
- Issue date Sep 10, 2019
- Semtech Corporation
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Stacking Semiconductor Die for S...
- Publication number 20220285334
- Publication date Sep 8, 2022
- SEMTECH CORPORATION
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single-Shot Encapsulation
- Publication number 20220028813
- Publication date Jan 27, 2022
- SEMTECH CORPORATION
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device for Electrical Overstress and Electrostatic Disch...
- Publication number 20200286884
- Publication date Sep 10, 2020
- SEMTECH CORPORATION
- David J. Rose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single-Shot Encapsulation
- Publication number 20190355689
- Publication date Nov 21, 2019
- SEMTECH CORPORATION
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Device for Electrical Overstress and Electrostatic Disch...
- Publication number 20180286854
- Publication date Oct 4, 2018
- SEMTECH CORPORATION
- David J. Rose
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transient Voltage Suppression Diodes with Reduced Harmonics, and Me...
- Publication number 20180102356
- Publication date Apr 12, 2018
- SEMTECH CORPORATION
- Maykel Ghorbanzadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single-Shot Encapsulation
- Publication number 20180047688
- Publication date Feb 15, 2018
- SEMTECH CORPORATION
- Kok Khoon Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Semiconductor Die for S...
- Publication number 20170250172
- Publication date Aug 31, 2017
- SEMTECH CORPORATION
- Changjun Huang
- H01 - BASIC ELECTRIC ELEMENTS

Jonathan Clark

Person

Patents Grantslast 30 patents

Single-shot encapsulation

Semiconductor device and method of stacking semiconductor die for s...

Method and device for electrical overstress and electrostatic disch...

Semiconductor device and method of stacking semiconductor die for s...

Single-shot encapsulation

Method and device for electrical overstress and electrostatic disch...

Transient voltage suppression diodes with reduced harmonics, and me...

Single-shot encapsulation

Patents Applicationslast 30 patents

Semiconductor Device and Method of Stacking Semiconductor Die for S...

Single-Shot Encapsulation

Method and Device for Electrical Overstress and Electrostatic Disch...

Single-Shot Encapsulation

Method and Device for Electrical Overstress and Electrostatic Disch...

Transient Voltage Suppression Diodes with Reduced Harmonics, and Me...

Single-Shot Encapsulation

Semiconductor Device and Method of Stacking Semiconductor Die for S...