Jonathan Fain

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Sachse, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Electronics package with improved thermal performance
- Patent number 10,840,165
- Issue date Nov 17, 2020
- Qorvo US, Inc.
- Jonathan J. Fain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics package with improved thermal performance
- Patent number 10,325,828
- Issue date Jun 18, 2019
- Qorvo US, Inc.
- Jonathan J. Fain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with lid having lid conductive structure
- Patent number 9,799,637
- Issue date Oct 24, 2017
- Qorvo US, Inc.
- Brian P. Balut
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONICS PACKAGE WITH IMPROVED THERMAL PERFORMANCE
- Publication number 20190252287
- Publication date Aug 15, 2019
- Qorvo US, Inc.
- Jonathan J. Fain
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS PACKAGE WITH IMPROVED THERMAL PERFORMANCE
- Publication number 20170287807
- Publication date Oct 5, 2017
- Qorvo US, Inc.
- Jonathan J. Fain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH LID HAVING LID CONDUCTIVE STRUCTURE
- Publication number 20170236808
- Publication date Aug 17, 2017
- Qorvo US, Inc.
- Brian P. Balut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER PACKAGE LID
- Publication number 20160240511
- Publication date Aug 18, 2016
- TriQuint Semiconductor, Inc.
- Robert Charles Dry
- H01 - BASIC ELECTRIC ELEMENTS