Jonathan Lie

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Patterned carrier assemblies having an integrated adhesive film
- Patent number 12,154,805
- Issue date Nov 26, 2024
- Daewon Semiconductor Packaging Industrial Company
- Jonathan Kevin Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separators for handling, transporting, or storing semiconductor wafers
- Patent number 12,106,988
- Issue date Oct 1, 2024
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separators for handling, transporting, or storing semiconductor wafers
- Patent number 11,257,700
- Issue date Feb 22, 2022
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
- Publication number 20240429080
- Publication date Dec 26, 2024
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
- Publication number 20230005771
- Publication date Jan 5, 2023
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED CARRIER ASSEMBLIES HAVING AN INTEGRATED ADHESIVE FILM
- Publication number 20220013390
- Publication date Jan 13, 2022
- Daewon Semiconductor Packaging Industrial Company
- Jonathan Kevin Lie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
- Publication number 20190067064
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATORS FOR HANDLING, TRANSPORTING, OR STORING SEMICONDUCTOR WAFERS
- Publication number 20190067062
- Publication date Feb 28, 2019
- Daewon Semiconductor Packaging Industrial Company
- Sunna Chang
- H01 - BASIC ELECTRIC ELEMENTS