Jonathan Michael Byars

Person

Fountan Valley, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and systems for aligning tooling elements of ultrasonic bon...
- Patent number 10,092,984
- Issue date Oct 9, 2018
- Kulicke and Soffa Industries, Inc.
- Jonathan Michael Byars
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and systems for aligning tooling elements of ultrasonic bon...
- Patent number 9,925,624
- Issue date Mar 27, 2018
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for aligning tooling elements of ultrasonic bon...
- Patent number 9,393,641
- Issue date Jul 19, 2016
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Support structures and clamping systems for semiconductor devices d...
- Patent number 9,038,998
- Issue date May 26, 2015
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wire loop forming systems and methods of using the same
- Patent number 8,998,063
- Issue date Apr 7, 2015
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device support for bonding
- Patent number 8,720,767
- Issue date May 13, 2014
- Orthodyne Electronics Corporation
- Jonathan Byars
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND SYSTEMS FOR ALIGNING TOOLING ELEMENTS OF ULTRASONIC BON...
- Publication number 20180169803
- Publication date Jun 21, 2018
- ORTHODYNE ELECTRONICS CORPORATION
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND SYSTEMS FOR ALIGNING TOOLING ELEMENTS OF ULTRASONIC BON...
- Publication number 20160297037
- Publication date Oct 13, 2016
- ORTHODYNE ELECTRONICS CORPORATION
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20150144682
- Publication date May 28, 2015
- ORTHODYNE ELECTRONICS CORPORATION
- Jonathan Michael Byars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND SYSTEMS FOR ALIGNING TOOLING ELEMENTS OF ULTRASONIC BON...
- Publication number 20130228611
- Publication date Sep 5, 2013
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME
- Publication number 20130200134
- Publication date Aug 8, 2013
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE
- Publication number 20130019458
- Publication date Jan 24, 2013
- Orthodyne Electronics Corporation
- Jonathan M. Byars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPORT STRUCTURES AND CLAMPING SYSTEMS FOR SEMICONDUCTOR DEVICES D...
- Publication number 20120274014
- Publication date Nov 1, 2012
- Orthodyne Electronics Corporation
- Jonathan Michael Byars
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE SUPPORT FOR BONDING
- Publication number 20110212572
- Publication date Sep 1, 2011
- Orthodyne Electronics Corporation
- Jonathan Byars
- H01 - BASIC ELECTRIC ELEMENTS

Jonathan Michael Byars

Person

Patents Grantslast 30 patents

Methods and systems for aligning tooling elements of ultrasonic bon...

Methods and systems for aligning tooling elements of ultrasonic bon...

Methods and systems for aligning tooling elements of ultrasonic bon...

Support structures and clamping systems for semiconductor devices d...

Wire loop forming systems and methods of using the same

Semiconductor device support for bonding

Patents Applicationslast 30 patents

METHODS AND SYSTEMS FOR ALIGNING TOOLING ELEMENTS OF ULTRASONIC BON...

METHODS AND SYSTEMS FOR ALIGNING TOOLING ELEMENTS OF ULTRASONIC BON...

WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME

METHODS AND SYSTEMS FOR ALIGNING TOOLING ELEMENTS OF ULTRASONIC BON...

WIRE LOOP FORMING SYSTEMS AND METHODS OF USING THE SAME

SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE

SUPPORT STRUCTURES AND CLAMPING SYSTEMS FOR SEMICONDUCTOR DEVICES D...

SEMICONDUCTOR DEVICE SUPPORT FOR BONDING