Jonathan R. Smith

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Hermetic wafer-to-wafer bonding with electrical interconnection
- Patent number 8,433,402
- Issue date Apr 30, 2013
- Medtronic, Inc.
- David A Ruben
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION
- Publication number 20110270341
- Publication date Nov 3, 2011
- Medtronic, Inc.
- David A. Ruben
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION
- Publication number 20110270099
- Publication date Nov 3, 2011
- Medtronic, Inc.
- David A. Ruben
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE