Jonathan Thibado

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
System device aggregation in a liquid cooling environment
- Patent number 12,082,370
- Issue date Sep 3, 2024
- Intel Corporation
- Aaron Gorius
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow grid array to support late attach of components
- Patent number 11,683,890
- Issue date Jun 20, 2023
- Intel Corporation
- Jonathan W. Thibado
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Interposer and electronic package
- Patent number 11,621,237
- Issue date Apr 4, 2023
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflowable grid array to support grid heating
- Patent number 11,545,408
- Issue date Jan 3, 2023
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflowable grid array as standby heater for reliability
- Patent number 11,488,839
- Issue date Nov 1, 2022
- Intel Corporation
- Jonathan W. Thibado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processor package with optimization based on package connection type
- Patent number 11,023,247
- Issue date Jun 1, 2021
- Intel Corporation
- Daniel Willis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Top-side connector interface for processor packaging
- Patent number 10,880,994
- Issue date Dec 29, 2020
- Intel Corporation
- Russell S. Aoki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rework grid array interposer with direct power
- Patent number 10,211,120
- Issue date Feb 19, 2019
- Intel Corporation
- Russell S. Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CPU package substrates with removable memory mechanical interfaces
- Patent number 9,832,876
- Issue date Nov 28, 2017
- Intel Corporation
- Mani Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly that includes a plurality of electronic packages
- Patent number 9,603,276
- Issue date Mar 21, 2017
- Intel Corporation
- David J. Llapitan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
REMOVABLE AND LOW INSERTION FORCE CONNECTOR SYSTEM
- Publication number 20210400813
- Publication date Dec 23, 2021
- Intel Corporation
- Jonathan W. THIBADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM DEVICE AGGREGATION IN A LIQUID COOLING ENVIRONMENT
- Publication number 20210385971
- Publication date Dec 9, 2021
- Intel Corporation
- Aaron GORIUS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIMINISHED PRINTED CIRCUIT BOARD (PCB) WARPAGE
- Publication number 20210120663
- Publication date Apr 22, 2021
- Intel Corporation
- Jonathan W. THIBADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOP-SIDE CONNECTOR INTERFACE FOR PROCESSOR PACKAGING
- Publication number 20210120668
- Publication date Apr 22, 2021
- Intel Corporation
- Russell S. Aoki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REFLOWABLE GRID ARRAY AS STANDBY HEATER FOR RELIABILITY
- Publication number 20200229309
- Publication date Jul 16, 2020
- Intel Corporation
- Jonathan W. THIBADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOWABLE GRID ARRAY WITH HIGH SPEED FLEX CABLES
- Publication number 20200227362
- Publication date Jul 16, 2020
- Intel Corporation
- Jonathan W. THIBADO
- G02 - OPTICS
Information Patent Application
REFLOWABLE GRID ARRAY TO SUPPORT GRID HEATING
- Publication number 20200229294
- Publication date Jul 16, 2020
- Intel Corporation
- Jonathan W. THIBADO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REFLOW GRID ARRAY TO SUPPORT LATE ATTACH OF COMPONENTS
- Publication number 20200205299
- Publication date Jun 25, 2020
- Intel Corporation
- Jonathan W. Thibado
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROCESSOR PACKAGE WITH OPTIMIZATION BASED ON PACKAGE CONNECTION TYPE
- Publication number 20190042270
- Publication date Feb 7, 2019
- Intel Corporation
- Daniel Willis
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONNECTOR INTERFACE FOR PROCESSOR PACKAGING
- Publication number 20180352649
- Publication date Dec 6, 2018
- Intel Corporation
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES
- Publication number 20180007791
- Publication date Jan 4, 2018
- Intel Corporation
- Mani Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP-SIDE CONNECTOR INTERFACE FOR PROCESSOR PACKAGING
- Publication number 20170354031
- Publication date Dec 7, 2017
- Intel Corporation
- Russell S. Aoki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Rework grid array interposer with direct power
- Publication number 20170186661
- Publication date Jun 29, 2017
- Intel Corporation
- Russell S. Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES
- Publication number 20170178994
- Publication date Jun 22, 2017
- Intel Corporation
- Michael Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK SOLDER REMOVAL ON PROCESSOR PACKAGING
- Publication number 20170179066
- Publication date Jun 22, 2017
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT CHIP ATTACHMENT USING LOCAL HEAT SOURCE
- Publication number 20160351526
- Publication date Dec 1, 2016
- Intel Corporation
- Thomas Alan Boyd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET THAT ENGAGES A PLURALITY OF ELECTRONIC PACKAGES
- Publication number 20160190716
- Publication date Jun 30, 2016
- Kuang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES
- Publication number 20160190717
- Publication date Jun 30, 2016
- David J. Llapitan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES
- Publication number 20160183374
- Publication date Jun 23, 2016
- Mani Prakash
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Brush for cleaning/scrubbing a substrate
- Publication number 20040040575
- Publication date Mar 4, 2004
- Alexander Tregub
- B08 - CLEANING

Jonathan Thibado

Person

Patents Grantslast 30 patents

System device aggregation in a liquid cooling environment

Reflow grid array to support late attach of components

Interposer and electronic package

Reflowable grid array to support grid heating

Reflowable grid array as standby heater for reliability

Processor package with optimization based on package connection type

Top-side connector interface for processor packaging

Rework grid array interposer with direct power

CPU package substrates with removable memory mechanical interfaces

Electronic assembly that includes a plurality of electronic packages

Patents Applicationslast 30 patents

REMOVABLE AND LOW INSERTION FORCE CONNECTOR SYSTEM

SYSTEM DEVICE AGGREGATION IN A LIQUID COOLING ENVIRONMENT

DIMINISHED PRINTED CIRCUIT BOARD (PCB) WARPAGE

TOP-SIDE CONNECTOR INTERFACE FOR PROCESSOR PACKAGING

REFLOWABLE GRID ARRAY AS STANDBY HEATER FOR RELIABILITY

REFLOWABLE GRID ARRAY WITH HIGH SPEED FLEX CABLES

REFLOWABLE GRID ARRAY TO SUPPORT GRID HEATING

REFLOW GRID ARRAY TO SUPPORT LATE ATTACH OF COMPONENTS

PROCESSOR PACKAGE WITH OPTIMIZATION BASED ON PACKAGE CONNECTION TYPE

CONNECTOR INTERFACE FOR PROCESSOR PACKAGING

CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES

TOP-SIDE CONNECTOR INTERFACE FOR PROCESSOR PACKAGING

Rework grid array interposer with direct power

INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES

BULK SOLDER REMOVAL ON PROCESSOR PACKAGING

INTEGRATED CIRCUIT CHIP ATTACHMENT USING LOCAL HEAT SOURCE

SOCKET THAT ENGAGES A PLURALITY OF ELECTRONIC PACKAGES

ELECTRONIC ASSEMBLY THAT INCLUDES A PLURALITY OF ELECTRONIC PACKAGES

CPU PACKAGE SUBSTRATES WITH REMOVABLE MEMORY MECHANICAL INTERFACES

Brush for cleaning/scrubbing a substrate