Jonathon Robert Carstens

Person

Lacey, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Cable retention assemblies including torsional elements
- Patent number 10,680,367
- Issue date Jun 9, 2020
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with temperature sensor traces
- Patent number 10,260,961
- Issue date Apr 16, 2019
- Intel Corporation
- Shelby Ferguson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warpage mitigation in printed circuit board assemblies
- Patent number 10,178,763
- Issue date Jan 8, 2019
- Intel Corporation
- Rashelle Yee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package alignment frame for local reflow
- Patent number 9,991,223
- Issue date Jun 5, 2018
- Intel Corporation
- Russell S. Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Linear edge connector with a cable retention mechanism having a bod...
- Patent number 9,825,387
- Issue date Nov 21, 2017
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BALL GRID ARRAY SOLDER ATTACHMENT
- Publication number 20180350767
- Publication date Dec 6, 2018
- Intel Corporation
- Jonathon R. Carstens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LINEAR EDGE CONNECTOR WITH A CABLE RETENTION MECHANISM HAVING A BOD...
- Publication number 20170288331
- Publication date Oct 5, 2017
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LINEAR EDGE CONNECTOR RETENTION
- Publication number 20170288330
- Publication date Oct 5, 2017
- Intel Corporation
- Feifei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH TEMPERATURE SENSOR TRACES
- Publication number 20170176260
- Publication date Jun 22, 2017
- Intel Corporation
- Shelby Ferguson
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW
- Publication number 20170179067
- Publication date Jun 22, 2017
- Intel Corporation
- RUSSELL S. AOKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WARPAGE MITIGATION IN PRINTED CIRCUIT BOARD ASSEMBLIES
- Publication number 20170181271
- Publication date Jun 22, 2017
- Intel Corporation
- Rashelle Yee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES
- Publication number 20170178994
- Publication date Jun 22, 2017
- Intel Corporation
- Michael Hui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY SOLDER ATTACHMENT
- Publication number 20170179069
- Publication date Jun 22, 2017
- Jonathon R. Carstens
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Jonathon Robert Carstens

Person

Patents Grantslast 30 patents

Cable retention assemblies including torsional elements

Integrated circuit packages with temperature sensor traces

Warpage mitigation in printed circuit board assemblies

Semiconductor package alignment frame for local reflow

Linear edge connector with a cable retention mechanism having a bod...

Patents Applicationslast 30 patents

BALL GRID ARRAY SOLDER ATTACHMENT

LINEAR EDGE CONNECTOR WITH A CABLE RETENTION MECHANISM HAVING A BOD...

LINEAR EDGE CONNECTOR RETENTION

INTEGRATED CIRCUIT PACKAGES WITH TEMPERATURE SENSOR TRACES

SEMICONDUCTOR PACKAGE ALIGNMENT FRAME FOR LOCAL REFLOW

WARPAGE MITIGATION IN PRINTED CIRCUIT BOARD ASSEMBLIES

INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES

BALL GRID ARRAY SOLDER ATTACHMENT