Jones Wang

Person

Jung-he city, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Enhanced adhesion strength between mold resin and polyimide
- Patent number 7,390,697
- Issue date Jun 24, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ken Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for stress reduction in flip chip bump during flip chip moun...
- Patent number 7,015,066
- Issue date Mar 21, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buildup substrate pad pre-solder bump manufacturing
- Patent number 6,960,518
- Issue date Nov 1, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced adhesion strength between mold resin and polyimide
- Patent number 6,884,662
- Issue date Apr 26, 2005
- Taiwan Semiconductor Manufacturing Company
- Ken Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical performance enhanced wafer level chip scale package with...
- Patent number 6,656,827
- Issue date Dec 2, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for protecting the front side of semiconductor wafers
- Patent number 6,638,837
- Issue date Oct 28, 2003
- Taiwan Semiconductor Manufacturing Company
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating as grooved heat spreader for stress reduction...
- Patent number 6,607,942
- Issue date Aug 19, 2003
- Taiwan Semiconductor Manufacturing Company
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Enhanced adhesion strength between mold resin and polyimide
- Publication number 20050167807
- Publication date Aug 4, 2005
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Ken Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of wafer level chip scale packaging
- Publication number 20030211720
- Publication date Nov 13, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chender Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grooved heat spreader for stress reduction in IC package
- Publication number 20030176020
- Publication date Sep 18, 2003
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for stress reduction in flip chip bump during flip chip moun...
- Publication number 20030045028
- Publication date Mar 6, 2003
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Pei-Haw Tsao
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Enhanced adhesion strength between mold resin and polyimide

Method for stress reduction in flip chip bump during flip chip moun...

Buildup substrate pad pre-solder bump manufacturing

Enhanced adhesion strength between mold resin and polyimide

Electrical performance enhanced wafer level chip scale package with...

Method for protecting the front side of semiconductor wafers

Method of fabricating as grooved heat spreader for stress reduction...

Patents Applicationslast 30 patents

Enhanced adhesion strength between mold resin and polyimide

Method of wafer level chip scale packaging

Grooved heat spreader for stress reduction in IC package

Method for stress reduction in flip chip bump during flip chip moun...