Jong-Kai Lin

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Shielding structures for signal paths in electronic devices
- Patent number 8,385,084
- Issue date Feb 26, 2013
- Jinbang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making an integrated circuit package with shielding via r...
- Patent number 8,097,494
- Issue date Jan 17, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded multi-layer package structures
- Patent number 8,004,068
- Issue date Aug 23, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielding structures for signal paths in electronic devices
- Patent number 7,869,225
- Issue date Jan 11, 2011
- Freescale Semiconductor, Inc.
- Jinbang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electromagnetic shield formation for integrated circuit die package
- Patent number 7,651,889
- Issue date Jan 26, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for EMI shielding in multi-chip modules
- Patent number 7,648,858
- Issue date Jan 19, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level MEMS packaging
- Patent number 6,953,985
- Issue date Oct 11, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Jong-Kai Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing components and component thereof
- Patent number 6,310,403
- Issue date Oct 30, 2001
- Motorola, Inc.
- Chunsheng Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for coupling substrates and structure
- Patent number 6,022,761
- Issue date Feb 8, 2000
- Motorola, Inc.
- Melissa E. Grupen-Shemansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrically conductive polymer bump over an a...
- Patent number 5,674,780
- Issue date Oct 7, 1997
- Motorola, Inc.
- William H. Lytle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electrical interconnect
- Patent number 5,587,342
- Issue date Dec 24, 1996
- Motorola, Inc.
- Jong-Kai Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for enhancing aluminum nitride
- Patent number 5,520,785
- Issue date May 28, 1996
- Motorola, Inc.
- Keenan L. Evans
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SHIELDING STRUCTURES FOR SIGNAL PATHS IN ELECTRONIC DEVICES
- Publication number 20110075394
- Publication date Mar 31, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE
- Publication number 20110003435
- Publication date Jan 6, 2011
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED MULTI-LAYER PACKAGE STRUCTURES
- Publication number 20100044840
- Publication date Feb 25, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE
- Publication number 20090075428
- Publication date Mar 19, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated shielding process for precision high density module pack...
- Publication number 20090072357
- Publication date Mar 19, 2009
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR EMI SHIELDING IN MULTI-CHIP MODULES
- Publication number 20080315371
- Publication date Dec 25, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conformal EMI shielding with enhanced reliability
- Publication number 20080315376
- Publication date Dec 25, 2008
- Jinbang Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING STRUCTURES FOR SIGNAL PATHS IN ELECTRONIC DEVICES
- Publication number 20080266829
- Publication date Oct 30, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Jinbang Tang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer level MEMS packaging
- Publication number 20030230798
- Publication date Dec 18, 2003
- Jong-Kai Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Jong-Kai Lin

Person

Patents Grantslast 30 patents

Shielding structures for signal paths in electronic devices

Method of making an integrated circuit package with shielding via r...

Shielded multi-layer package structures

Shielding structures for signal paths in electronic devices

Electromagnetic shield formation for integrated circuit die package

Methods and apparatus for EMI shielding in multi-chip modules

Wafer level MEMS packaging

Method of manufacturing components and component thereof

Method for coupling substrates and structure

Method of forming an electrically conductive polymer bump over an a...

Method of forming an electrical interconnect

Method for enhancing aluminum nitride

Patents Applicationslast 30 patents

SHIELDING STRUCTURES FOR SIGNAL PATHS IN ELECTRONIC DEVICES

ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE

SHIELDED MULTI-LAYER PACKAGE STRUCTURES

ELECTROMAGNETIC SHIELD FORMATION FOR INTEGRATED CIRCUIT DIE PACKAGE

Integrated shielding process for precision high density module pack...

METHODS AND APPARATUS FOR EMI SHIELDING IN MULTI-CHIP MODULES

Conformal EMI shielding with enhanced reliability

SHIELDING STRUCTURES FOR SIGNAL PATHS IN ELECTRONIC DEVICES

Wafer level MEMS packaging