Jong Kyu MOON

Person

Namyangju-si Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die pickup apparatus
- Patent number 12,255,083
- Issue date Mar 18, 2025
- SK hynix Inc.
- Jae Yeong Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating semiconductor packages by using a mold pres...
- Patent number 11,501,981
- Issue date Nov 15, 2022
- SK hynix Inc.
- Kyung Beom Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through electrodes and methods of manu...
- Patent number 10,109,545
- Issue date Oct 23, 2018
- SK Hynix Inc.
- Jong Kyu Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including molded stacked die with terrace-li...
- Patent number 9,773,756
- Issue date Sep 26, 2017
- SK hynix Inc.
- Jong Kyu Moon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A DAM
- Publication number 20240304467
- Publication date Sep 12, 2024
- SK HYNIX INC.
- Kyung Beom SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK PACKAGE INCLUDING SEMICONDUCTOR DIES AND ENCAPSULANT
- Publication number 20240014175
- Publication date Jan 11, 2024
- SK HYNIX INC.
- Kyung Beom SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PICKUP APPARATUS
- Publication number 20230230860
- Publication date Jul 20, 2023
- SK HYNIX INC.
- Jae Yeong JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING SEMICONDUCTOR PACKAGES
- Publication number 20220115247
- Publication date Apr 14, 2022
- SK HYNIX INC.
- Kyung Beom SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS OF MANU...
- Publication number 20170186659
- Publication date Jun 29, 2017
- SK HYNIX INC.
- Jong Kyu MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING MOLDED STACKED DIE WITH TERRACE-LI...
- Publication number 20170154872
- Publication date Jun 1, 2017
- SK HYNIX INC.
- Jong Kyu MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS OF MANU...
- Publication number 20150270220
- Publication date Sep 24, 2015
- SK HYNIX INC.
- Jong Kyu MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, METHODS OF MANUFACTURING THE SAME, MEMORY CA...
- Publication number 20150123278
- Publication date May 7, 2015
- SK HYNIX INC.
- Sung Su PARK
- H01 - BASIC ELECTRIC ELEMENTS

Jong Kyu MOON

Person

Patents Grantslast 30 patents

Semiconductor die pickup apparatus

Methods for fabricating semiconductor packages by using a mold pres...

Semiconductor devices having through electrodes and methods of manu...

Semiconductor packages including molded stacked die with terrace-li...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING A DAM

STACK PACKAGE INCLUDING SEMICONDUCTOR DIES AND ENCAPSULANT

SEMICONDUCTOR DIE PICKUP APPARATUS

METHODS FOR FABRICATING SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS OF MANU...

SEMICONDUCTOR PACKAGES INCLUDING MOLDED STACKED DIE WITH TERRACE-LI...

SEMICONDUCTOR DEVICES HAVING THROUGH ELECTRODES AND METHODS OF MANU...

SEMICONDUCTOR DEVICES, METHODS OF MANUFACTURING THE SAME, MEMORY CA...