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Jong Myoung Son
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Chungcheongnam-do, KR
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last 30 patents
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Patent Grant
Method of manufacturing semiconductor package having no chip pad
Patent number
8,802,498
Issue date
Aug 12, 2014
STS Semiconductor & Telecommunications Co., Ltd.
Jong Myoung Son
H01 - BASIC ELECTRIC ELEMENTS
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last 30 patents
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Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE HAVING NO CHIP PAD
Publication number
20130316496
Publication date
Nov 28, 2013
STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.
Jong Myoung Son
H01 - BASIC ELECTRIC ELEMENTS