Jong Ok Chun

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Shielded electronic component package
- Patent number 12,040,305
- Issue date Jul 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic component package
- Patent number 11,646,290
- Issue date May 9, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic component package
- Patent number 11,031,366
- Issue date Jun 8, 2021
- Amkor Technology Singapore Pte. Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic component package
- Patent number 10,424,556
- Issue date Sep 24, 2019
- Amkor Technology, Inc.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shield lid interconnect package and method
- Patent number 9,433,117
- Issue date Aug 30, 2016
- Amkor Technology, Inc.
- Jong Ok Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Top feature package and method
- Patent number 8,199,518
- Issue date Jun 12, 2012
- Amkor Technology, Inc.
- Jong Ok Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielding for a semiconductor package
- Patent number 8,129,824
- Issue date Mar 6, 2012
- Amkor Technology, Inc.
- Roger D. St. Amand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for RF shielding of a semiconductor package
- Patent number 8,093,691
- Issue date Jan 10, 2012
- Amkor Technology, Inc.
- Ruben Fuentes
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20230275061
- Publication date Aug 31, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20220052016
- Publication date Feb 17, 2022
- Amkor Technology Singapore Holding Pte. Ltd
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20190371760
- Publication date Dec 5, 2019
- Amkor Technology, Inc.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDED ELECTRONIC COMPONENT PACKAGE
- Publication number 20160351525
- Publication date Dec 1, 2016
- Amkor Technology, Inc.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS

Jong Ok Chun

Person

Patents Grantslast 30 patents

Shielded electronic component package

Shielded electronic component package

Shielded electronic component package

Shielded electronic component package

Shield lid interconnect package and method

Top feature package and method

Shielding for a semiconductor package

System and method for RF shielding of a semiconductor package

Patents Applicationslast 30 patents

SHIELDED ELECTRONIC COMPONENT PACKAGE

SHIELDED ELECTRONIC COMPONENT PACKAGE

SHIELDED ELECTRONIC COMPONENT PACKAGE

SHIELDED ELECTRONIC COMPONENT PACKAGE