Jong Sik Paek

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device assemblies and systems with one or more dies a...
- Patent number 12,125,816
- Issue date Oct 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 12,051,684
- Issue date Jul 30, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die modules for semiconductor device assemblies and methods...
- Patent number 11,942,430
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies for semiconductor device assemblies
- Patent number 11,942,455
- Issue date Mar 26, 2024
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground connection for semiconductor device assembly
- Patent number 11,764,161
- Issue date Sep 19, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 11,749,665
- Issue date Sep 5, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with package-level compartmental shielding an...
- Patent number 11,515,174
- Issue date Nov 29, 2022
- Micron Technology, Inc.
- Youngik Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-to-face semiconductor device with fan-out porch
- Patent number 11,456,289
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor dies for semiconductor device assemblies
- Patent number 11,362,071
- Issue date Jun 14, 2022
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20240387499
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE
- Publication number 20240274578
- Publication date Aug 15, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS...
- Publication number 20240258243
- Publication date Aug 1, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE-PROTECTED SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS
- Publication number 20240113002
- Publication date Apr 4, 2024
- Micron Technology, Inc.
- Ya Ling Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS AIR VENT
- Publication number 20240063067
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20230420440
- Publication date Dec 28, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL CHIP SCALE PACKAGING WITH COPPER CORE BALL EMBEDDED INT...
- Publication number 20230369266
- Publication date Nov 16, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DIES WITH PERIMETER PROFILES FOR S...
- Publication number 20230268229
- Publication date Aug 24, 2023
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL COMPARTMENTAL SHIELDING AN...
- Publication number 20230041760
- Publication date Feb 9, 2023
- Micron Technology, Inc.
- Youngik Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20230013960
- Publication date Jan 19, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS...
- Publication number 20230009643
- Publication date Jan 12, 2023
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20220271013
- Publication date Aug 25, 2022
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH ONE OR MORE DIES A...
- Publication number 20220208713
- Publication date Jun 30, 2022
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES
- Publication number 20220059500
- Publication date Feb 24, 2022
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DIES WITH PERIMETER PROFILES FOR S...
- Publication number 20210202318
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Yeongbeom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20210202454
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND CONNECTION FOR SEMICONDUCTOR DEVICE ASSEMBLY
- Publication number 20210175182
- Publication date Jun 10, 2021
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL COMPARTMENTAL SHIELDING AN...
- Publication number 20210143073
- Publication date May 13, 2021
- Micron Technology, Inc.
- Youngik Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Jong Sik Paek

Person

Patents Grantslast 30 patents

Semiconductor device assemblies and systems with one or more dies a...

Face-to-face semiconductor device with fan-out porch

Stacked die modules for semiconductor device assemblies and methods...

Stacked semiconductor dies for semiconductor device assemblies

Ground connection for semiconductor device assembly

Face-to-face semiconductor device with fan-out porch

Semiconductor devices with package-level compartmental shielding an...

Face-to-face semiconductor device with fan-out porch

Stacked semiconductor dies for semiconductor device assemblies

Patents Applicationslast 30 patents

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

STACKED SEMICONDUCTOR DEVICE

STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS...

EDGE-PROTECTED SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS

SEMICONDUCTOR DEVICE WITH A POROUS AIR VENT

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

WAFER-LEVEL CHIP SCALE PACKAGING WITH COPPER CORE BALL EMBEDDED INT...

METHODS OF FORMING SEMICONDUCTOR DIES WITH PERIMETER PROFILES FOR S...

SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL COMPARTMENTAL SHIELDING AN...

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

STACKED DIE MODULES FOR SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS...

STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES

SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH ONE OR MORE DIES A...

STACKED SEMICONDUCTOR DIES FOR SEMICONDUCTOR DEVICE ASSEMBLIES

METHODS OF FORMING SEMICONDUCTOR DIES WITH PERIMETER PROFILES FOR S...

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

GROUND CONNECTION FOR SEMICONDUCTOR DEVICE ASSEMBLY

SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL COMPARTMENTAL SHIELDING AN...