Jong Wook Ju

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Singapore, SG

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Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM INCLUDING HONEYCOMB MOLDING
- Publication number 20070158806
- Publication date Jul 12, 2007
- STATS ChipPAC Ltd.
- Hyeog Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PLANAR INTERCONNECTS
- Publication number 20070063331
- Publication date Mar 22, 2007
- STATS ChipPAC Ltd.
- Hyeog Chan Kwon
- H01 - BASIC ELECTRIC ELEMENTS