Jong-Yun MYUNG

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a solder and method of fabricating t...
- Patent number 9,159,688
- Issue date Oct 13, 2015
- Samsung Electronics Co., Ltd.
- Jong Yun Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure, having concave lateral sides, semiconductor package...
- Patent number 8,922,008
- Issue date Dec 30, 2014
- Samsung Electronics Co., Ltd.
- Jong-Yun Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device
- Patent number 8,563,349
- Issue date Oct 22, 2013
- Samsung Electronics Co., Ltd.
- Jong-Yun Myung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of packaging semiconductor devices including bridge patterns
- Patent number 8,304,288
- Issue date Nov 6, 2012
- Samsung Electronics Co., Ltd.
- Hyuek-Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20140217580
- Publication date Aug 7, 2014
- Samsung Electronics Co., Ltd.
- Jong Yun MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE, SEMICONDUCTOR PACKAGE HAVING THE BUMP STRUCTURE, AN...
- Publication number 20130292822
- Publication date Nov 7, 2013
- Samsung Electronics Co., Ltd.
- Jong-Yun MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SEMICONDUCTOR DEVICE
- Publication number 20120156823
- Publication date Jun 21, 2012
- Jong-Yun MYUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Packaging Semiconductor Devices Including Bridge Patterns
- Publication number 20110306167
- Publication date Dec 15, 2011
- Hyuek-Jae Lee
- H01 - BASIC ELECTRIC ELEMENTS