JongBo Shim

Person

Asan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package structure having interposer substrate, and st...
- Patent number 12,148,729
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an interposer and method of fabrica...
- Patent number 12,062,605
- Issue date Aug 13, 2024
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,033,924
- Issue date Jul 9, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including interposer and method of manufactur...
- Patent number 12,021,036
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Jongbo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a support solder ball
- Patent number 11,948,873
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,876,083
- Issue date Jan 16, 2024
- Samsung Electronics Co., Ltd.
- Dongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate and semiconductor package including...
- Patent number 11,854,989
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Dongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having package on package structure and method...
- Patent number 11,804,477
- Issue date Oct 31, 2023
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor packages
- Patent number 11,798,889
- Issue date Oct 24, 2023
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,728,230
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 11,710,673
- Issue date Jul 25, 2023
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having supporting members
- Patent number 11,676,949
- Issue date Jun 13, 2023
- Samsung Electronics Co., Ltd.
- Taeseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an interposer and method of fabrica...
- Patent number 11,658,107
- Issue date May 23, 2023
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, and package on package having the same
- Patent number 11,581,263
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including interposer and method of manufactur...
- Patent number 11,521,934
- Issue date Dec 6, 2022
- Samsung Electronics Co., Ltd.
- Jongbo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having a dam structure
- Patent number 11,437,293
- Issue date Sep 6, 2022
- Samsung Electronics Co., Ltd.
- Dongho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an embedded semiconductor device
- Patent number 11,404,382
- Issue date Aug 2, 2022
- Samsung Electronics Co., Ltd.
- Jihwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including an in interposer and method of fabr...
- Patent number 11,367,679
- Issue date Jun 21, 2022
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with interposer
- Patent number 11,367,688
- Issue date Jun 21, 2022
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device
- Patent number 11,367,714
- Issue date Jun 21, 2022
- Samsung Electronics Co., Ltd.
- Jangwoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a redistribution line
- Patent number 11,152,416
- Issue date Oct 19, 2021
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with connection substrate and method of manuf...
- Patent number 10,978,431
- Issue date Apr 13, 2021
- Samsung Electronics Co., Ltd.
- Jongbo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having second pad electrically connected thro...
- Patent number 10,923,428
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming redistribution lines and methods of manufacturin...
- Patent number 10,748,953
- Issue date Aug 18, 2020
- Samsung Electronics Co., Ltd.
- Yonghoe Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a redistribution line
- Patent number 10,651,224
- Issue date May 12, 2020
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,636,760
- Issue date Apr 28, 2020
- Samsung Electronics Co., Ltd.
- Seunghoon Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming redistribution lines and methods of manufacturin...
- Patent number 10,615,213
- Issue date Apr 7, 2020
- Samsung Electronics Co., Ltd.
- Yonghoe Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,361,170
- Issue date Jul 23, 2019
- Samsung Electronics Co., Ltd.
- Sungeun Pyo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 9,425,111
- Issue date Aug 23, 2016
- Samsung Electronics Co., Ltd.
- Jin-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 9,112,062
- Issue date Aug 18, 2015
- Samsung Electronics Co., Ltd.
- JiSun Hong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240429110
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jangwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321701
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240128174
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE...
- Publication number 20240096840
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING
- Publication number 20240079250
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- JAEWON CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240079285
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Jeongmin Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...
- Publication number 20240063181
- Publication date Feb 22, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...
- Publication number 20240014191
- Publication date Jan 11, 2024
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230402357
- Publication date Dec 14, 2023
- Samsung Electronics Co., Ltd.
- JONGBO SHIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230361051
- Publication date Nov 9, 2023
- SAMSUNG ELECTRONICS CO,. LTD.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230361018
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20230352411
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Yunseok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...
- Publication number 20230260891
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- JI HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230112061
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Eunho CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230114274
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- Jeonghyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD OF MANUFACTUR...
- Publication number 20230075292
- Publication date Mar 9, 2023
- Samsung Electronics Co., Ltd.
- Jongbo Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230042622
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A LOWER SUBSTRATE AND AN UPPER SUBS...
- Publication number 20230021867
- Publication date Jan 26, 2023
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING A DAM STRUCTURE
- Publication number 20220384291
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Dongho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220384320
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Jeonghyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A SUPPORT SOLDER BALL
- Publication number 20220352058
- Publication date Nov 3, 2022
- Samsung Electronics Co., Ltd.
- Jeonghyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE HAVING INTERPOSER SUBSTRATE, AND ST...
- Publication number 20220352110
- Publication date Nov 3, 2022
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...
- Publication number 20220319973
- Publication date Oct 6, 2022
- Samsung Electronics Co., Ltd.
- JI HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTERPOSER
- Publication number 20220302035
- Publication date Sep 22, 2022
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220189835
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...
- Publication number 20220181309
- Publication date Jun 9, 2022
- Samsung Electronics Co., Ltd.
- Jeonghyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING SUPPORTING MEMBERS
- Publication number 20220173081
- Publication date Jun 2, 2022
- Samsung Electronics Co., Ltd.
- Taeseok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220173082
- Publication date Jun 2, 2022
- Samsung Electronics Co., Ltd.
- Dongho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220115281
- Publication date Apr 14, 2022
- Samsung Electronics Co., Ltd.
- JI HWANG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD OF MANUFACTUR...
- Publication number 20220013464
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Jongbo Shim
- H01 - BASIC ELECTRIC ELEMENTS

JongBo Shim

Person

Patents Grantslast 30 patents

Semiconductor package structure having interposer substrate, and st...

Semiconductor package including an interposer and method of fabrica...

Semiconductor package

Semiconductor package including interposer and method of manufactur...

Semiconductor package including a support solder ball

Semiconductor package

Semiconductor package substrate and semiconductor package including...

Semiconductor device having package on package structure and method...

Methods of manufacturing semiconductor packages

Semiconductor package and method of fabricating the same

Interposer and semiconductor package including the same

Semiconductor packages having supporting members

Semiconductor package including an interposer and method of fabrica...

Semiconductor package, and package on package having the same

Semiconductor package including interposer and method of manufactur...

Semiconductor packages having a dam structure

Semiconductor package including an embedded semiconductor device

Semiconductor package including an in interposer and method of fabr...

Semiconductor package with interposer

Semiconductor package device

Semiconductor package including a redistribution line

Semiconductor package with connection substrate and method of manuf...

Semiconductor package having second pad electrically connected thro...

Methods of forming redistribution lines and methods of manufacturin...

Semiconductor package including a redistribution line

Semiconductor packages

Methods of forming redistribution lines and methods of manufacturin...

Semiconductor package

Semiconductor package

Semiconductor device and method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SEMICONDUCT...

SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD OF MANUFACTUR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A LOWER SUBSTRATE AND AN UPPER SUBS...

SEMICONDUCTOR PACKAGES HAVING A DAM STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING A SUPPORT SOLDER BALL

SEMICONDUCTOR PACKAGE STRUCTURE HAVING INTERPOSER SUBSTRATE, AND ST...

SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER AND METHOD OF FABRICA...

SEMICONDUCTOR PACKAGE WITH INTERPOSER

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE HAVING PACKAGE ON PACKAGE STRUCTURE AND METHOD...

SEMICONDUCTOR PACKAGES HAVING SUPPORTING MEMBERS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD OF MANUFACTUR...