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Jonggi Lee

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  • Yongin-si, KR
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor packages
    • Patent number 9,530,755
    • Issue date Dec 27, 2016
    • Samsung Electronics Co., Ltd.
    • Seung-Yeol Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor packages and methods of fabricating the same
    • Patent number 8,921,163
    • Issue date Dec 30, 2014
    • Samsung Electronics Co., Ltd.
    • Sangwook Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Reflow method
    • Patent number 8,536,045
    • Issue date Sep 17, 2013
    • Samsung Electronics Co., Ltd.
    • Minill Kim
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor packages
    • Patent number 8,456,018
    • Issue date Jun 4, 2013
    • Samsung Electronics Co., Ltd.
    • Sangwook Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil and semiconductor apparatus having the same
    • Patent number 8,420,989
    • Issue date Apr 16, 2013
    • Samsung Electronics Co., Ltd.
    • Minill Kim
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Reflow apparatus, reflow method, and package apparatus
    • Patent number 8,324,522
    • Issue date Dec 4, 2012
    • Samsung Electronics Co., Ltd.
    • Minill Kim
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Circuit manufacturing apparatus
    • Patent number 8,051,555
    • Issue date Nov 8, 2011
    • Samsung Electronics Co., Ltd.
    • Minill Kim
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents