Jonggu Lee

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor package
- Patent number 11,848,301
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Bonding head including a thermal compensator, die bonding apparatus...
- Patent number 11,626,381
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor chip bonding apparatus including head having thermall...
- Patent number 11,607,741
- Issue date Mar 21, 2023
- Samsung Electronics Co., Ltd.
- Sebin Choi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE SUPPORTING APPARATUS
- Publication number 20240079264
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Jonggu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY MODULE, BATTERY PACK INCLUDING BATTERY MODULE, AND VEHICLE...
- Publication number 20240021911
- Publication date Jan 18, 2024
- Hyundai Motor Company
- Gungoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE
- Publication number 20230238351
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER CHUCK TABLE AND WAFER CHUCK SYSTEM
- Publication number 20230207369
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS TO PERFORMING UPLINK TRANSMISSION BASED ON CON...
- Publication number 20230199754
- Publication date Jun 22, 2023
- LG ELECTRONICS INC.
- Jonggu LEE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
APPARATUS AND METHOD FOR CONTROLLING CHUCKING FORCE
- Publication number 20230191547
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- Jeongdu KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING HEAD, DIE BONDING APPARATUS INCLUDING THE SAME AND METHOD O...
- Publication number 20210098415
- Publication date Apr 1, 2021
- Samsung Electronics Co., Ltd.
- Jonggu LEE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR CHIP BONDING APPARATUS INCLUDING HEAD HAVING THERMALL...
- Publication number 20210069811
- Publication date Mar 11, 2021
- Samsung Electronics Co., Ltd.
- Sebin CHOI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Method of manufacturing a semiconductor package

Bonding head including a thermal compensator, die bonding apparatus...

Semiconductor chip bonding apparatus including head having thermall...

Patents Applicationslast 30 patents

SUBSTRATE SUPPORTING APPARATUS

BATTERY MODULE, BATTERY PACK INCLUDING BATTERY MODULE, AND VEHICLE...

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE

WAFER CHUCK TABLE AND WAFER CHUCK SYSTEM

METHOD AND APPARATUS TO PERFORMING UPLINK TRANSMISSION BASED ON CON...

APPARATUS AND METHOD FOR CONTROLLING CHUCKING FORCE

BONDING HEAD, DIE BONDING APPARATUS INCLUDING THE SAME AND METHOD O...

SEMICONDUCTOR CHIP BONDING APPARATUS INCLUDING HEAD HAVING THERMALL...