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Jonggyu LEE

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  • Suwon-si, KR
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Patents Applicationslast 30 patents

  • Information Patent Application

    HEAT DISSIPATION STRUCTURES
    • Publication number 20240321682
    • Publication date Sep 26, 2024
    • Samsung Electronics Co., Ltd.
    • Jonggyu Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240186290
    • Publication date Jun 6, 2024
    • Samsung Electronics Co., Ltd.
    • Taehwan KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH A HEAT DISSIPATION MEMBER
    • Publication number 20240170366
    • Publication date May 23, 2024
    • Samsung Electronics Co., Ltd.
    • Jonggyu Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20240145360
    • Publication date May 2, 2024
    • Samsung Electronics Co., Ltd.
    • Hwanjoo PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240079366
    • Publication date Mar 7, 2024
    • Samsung Electronics Co., Ltd.
    • Jonggyu Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240055339
    • Publication date Feb 15, 2024
    • Samsung Electronics Co., Ltd.
    • Hwanjoo Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND COOLING SYSTEM THEREOF
    • Publication number 20230307318
    • Publication date Sep 28, 2023
    • Samsung Electronics Co., Ltd.
    • Jonggyu LEE
    • H01 - BASIC ELECTRIC ELEMENTS