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Jonghyeon CHANG

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Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate debonding apparatus
    • Patent number 12,205,832
    • Issue date Jan 21, 2025
    • Samsung Electronics Co., Ltd.
    • Jonghyeon Chang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR CHIP
    • Publication number 20230057061
    • Publication date Feb 23, 2023
    • Samsung Electronics Co., Ltd.
    • Seyeong SEOK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATE DEBONDING APPARATUS
    • Publication number 20230052565
    • Publication date Feb 16, 2023
    • Samsung Electronics Co., Ltd.
    • Jonghyeon CHANG
    • H01 - BASIC ELECTRIC ELEMENTS