Jongkook Kim

Person

Hwaseong-City, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Test board and test apparatus including the same
- Patent number 11,828,791
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Kijae Song
- G01 - MEASURING TESTING
Information Patent Grant
Thermal interface material layer and package-on-package device incl...
- Patent number 10,950,521
- Issue date Mar 16, 2021
- Samsung Electronics Co., Ltd.
- Min-Ok Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having semiconductor chips disposed in openi...
- Patent number 10,825,776
- Issue date Nov 3, 2020
- Samsung Electronics Co., Ltd.
- Yoonha Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material layer and package-on-package device incl...
- Patent number 10,431,522
- Issue date Oct 1, 2019
- Samsung Electronics Co., Ltd.
- Min-Ok Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having semiconductor chips disposed in openi...
- Patent number 10,211,159
- Issue date Feb 19, 2019
- Samsung Electronics Co., Ltd.
- Yoonha Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material layer and package-on-package device incl...
- Patent number 9,899,294
- Issue date Feb 20, 2018
- Samsung Electronics Co., Ltd.
- Min-Ok Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having semiconductor chips disposed in openi...
- Patent number 9,425,156
- Issue date Aug 23, 2016
- Samsung Electronics Co., Ltd.
- Yoonha Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates and integrated circuit packages including the same
- Patent number 9,370,098
- Issue date Jun 14, 2016
- Samsung Electronics Co., Ltd.
- Byoung Wook Jang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package-on-package devices and methods of manufacturing the same
- Patent number 9,355,931
- Issue date May 31, 2016
- Samsung Electronics Co., Ltd.
- Jongkook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,252,031
- Issue date Feb 2, 2016
- Samsung Electronics Co., Ltd.
- Hohyeuk Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,252,095
- Issue date Feb 2, 2016
- Samsung Electronics Co., Ltd.
- Jongkook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chips having guard rings and methods of fabricating t...
- Patent number 8,623,743
- Issue date Jan 7, 2014
- Samsung Electronics Co., Ltd.
- Jung-Do Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chips having guard rings and methods of fabricating t...
- Patent number 8,354,735
- Issue date Jan 15, 2013
- Samsung Electronics Co., Ltd.
- Jung-Do Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 8,304,876
- Issue date Nov 6, 2012
- Samsung Electronics Co., Ltd.
- Hak-Kyoon Byun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A STIFFENER
- Publication number 20250167135
- Publication date May 22, 2025
- STATS ChipPAC Pte Ltd.
- Jongkook Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250157958
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250157867
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250062260
- Publication date Feb 20, 2025
- SAMSUNG ELECTRONICS CO., LTD,
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20250046721
- Publication date Feb 6, 2025
- Samsung Electronics Co.,Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250022844
- Publication date Jan 16, 2025
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240395720
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20240379635
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240355802
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Chengtar WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240355794
- Publication date Oct 24, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240339411
- Publication date Oct 10, 2024
- Samsung Electronics Co., Ltd.
- CHENGTAR WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240321851
- Publication date Sep 26, 2024
- SAMSUNG ELECTERONICS CO., LTD.
- CHOONGBIN YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240290762
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240274579
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING...
- Publication number 20240258221
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D INTEGRATED CIRCUIT (3DIC) STRUCTURES AND METHODS FOR MANUFACTURI...
- Publication number 20240258222
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Chengtar WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST BOARD AND TEST APPARATUS INCLUDING THE SAME
- Publication number 20220365132
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Kijae SONG
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210407962
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Hongwon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...
- Publication number 20200006188
- Publication date Jan 2, 2020
- SAMSUNG ELECTRONICS CO., LTD.
- Min-Ok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST INTERFACE BOARD AND SYSTEM INCLUDING THE SAME
- Publication number 20190164851
- Publication date May 30, 2019
- SAMSUNG ELECTRONICS CO., LTD.
- JONGWOON YOO
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...
- Publication number 20190139899
- Publication date May 9, 2019
- Samsung Electronics Co., Ltd.
- Yoonha JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...
- Publication number 20180145006
- Publication date May 24, 2018
- Samsung Electronics Co., Ltd.
- Min-Ok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...
- Publication number 20160329285
- Publication date Nov 10, 2016
- Samsung Electronics Co., Ltd.
- Yoonha JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...
- Publication number 20160190035
- Publication date Jun 30, 2016
- Min-Ok NA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20160111347
- Publication date Apr 21, 2016
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20150206869
- Publication date Jul 23, 2015
- Jongkook KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES AND INTEGRATED CIRCUIT PACKAGES INCLUDING THE SAME
- Publication number 20150189750
- Publication date Jul 2, 2015
- Byoung Wook JANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP AND METHOD OF FORMING THE SAME
- Publication number 20150155216
- Publication date Jun 4, 2015
- Samsung Electronics Co., Ltd.
- JONGKOOK KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150084170
- Publication date Mar 26, 2015
- Hohyeuk IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20150035148
- Publication date Feb 5, 2015
- Heeseok LEE
- H01 - BASIC ELECTRIC ELEMENTS

Jongkook Kim

Person

Patents Grantslast 30 patents

Test board and test apparatus including the same

Thermal interface material layer and package-on-package device incl...

Semiconductor packages having semiconductor chips disposed in openi...

Thermal interface material layer and package-on-package device incl...

Semiconductor packages having semiconductor chips disposed in openi...

Thermal interface material layer and package-on-package device incl...

Semiconductor packages having semiconductor chips disposed in openi...

Package substrates and integrated circuit packages including the same

Package-on-package devices and methods of manufacturing the same

Semiconductor package and method of fabricating the same

Semiconductor package and method of fabricating the same

Semiconductor chips having guard rings and methods of fabricating t...

Semiconductor chips having guard rings and methods of fabricating t...

Semiconductor package and method for manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE INCLUDING A STIFFENER

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

3D INTEGRATED CIRCUIT (3DIC) STRUCTURE AND METHOD FOR MANUFACTURING...

3D INTEGRATED CIRCUIT (3DIC) STRUCTURES AND METHODS FOR MANUFACTURI...

TEST BOARD AND TEST APPARATUS INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...

TEST INTERFACE BOARD AND SYSTEM INCLUDING THE SAME

SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...

THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...

SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENI...

THERMAL INTERFACE MATERIAL LAYER AND PACKAGE-ON-PACKAGE DEVICE INCL...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

PACKAGE-ON-PACKAGE DEVICES AND METHODS OF MANUFACTURING THE SAME

PACKAGE SUBSTRATES AND INTEGRATED CIRCUIT PACKAGES INCLUDING THE SAME

SEMICONDUCTOR CHIP AND METHOD OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME