Jongmin JEON

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Flexible printed circuit board and electronic device including the...
- Patent number 12,273,992
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid flexible printed circuit board and electronic device comprisi...
- Patent number 12,185,464
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including thermosetting bonding sheet
- Patent number 12,144,115
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Printed circuit board for transmitting signal in high-frequency ban...
- Patent number 11,617,257
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rigid-flexible printed circuit board and electronic device includin...
- Patent number 11,564,311
- Issue date Jan 24, 2023
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board and electronic device having the same
- Patent number 11,516,912
- Issue date Nov 29, 2022
- Samsung Electronics Co., Ltd.
- Jongmin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board having copper clad laminate laminated on core layer,...
- Patent number 11,510,312
- Issue date Nov 22, 2022
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IMAGE SENSOR
- Publication number 20250234660
- Publication date Jul 17, 2025
- Samsung Electronics Co., Ltd.
- Kijoong YOON
Information Patent Application
ELECTRONIC DEVICE INCLUDING SUBSTRATE INCLUDING COATING LAYER
- Publication number 20250063676
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20240234458
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Je-Hyung RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR
- Publication number 20240145514
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- JAESUNG HUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105746
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Jongmin JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME
- Publication number 20230354511
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20230170376
- Publication date Jun 1, 2023
- Samsung Electronics Co., Ltd.
- KIJOONG YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR AND METHOD OF FABRICATING THE SAME
- Publication number 20230121884
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- JAESUNG HUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING THERMOSETTING BONDING SHEET
- Publication number 20230119170
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- B32 - LAYERED PRODUCTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE...
- Publication number 20220346224
- Publication date Oct 27, 2022
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR TRANSMITTING SIGNAL IN HIGH-FREQUENCY BAN...
- Publication number 20220322522
- Publication date Oct 6, 2022
- Samsung Electronics Co., LTD
- Youngsun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISI...
- Publication number 20220151070
- Publication date May 12, 2022
- Samsung Electronics Co., Ltd.
- Youngsun Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDIN...
- Publication number 20210251071
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE HAVING THE SAME
- Publication number 20210195736
- Publication date Jun 24, 2021
- SAMSUNG ELECTRONICS CO., LTD.
- Jongmin Jeon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING COPPER CLAD LAMINATE LAMINATED ON CORE LAYER,...
- Publication number 20210168934
- Publication date Jun 3, 2021
- Samsung Electronics Co., Ltd.
- Youngsun LEE
- H01 - BASIC ELECTRIC ELEMENTS

Jongmin JEON

Person

Patents Grantslast 30 patents

Flexible printed circuit board and electronic device including the...

Rigid flexible printed circuit board and electronic device comprisi...

Electronic device including thermosetting bonding sheet

Printed circuit board for transmitting signal in high-frequency ban...

Rigid-flexible printed circuit board and electronic device includin...

Printed circuit board and electronic device having the same

Circuit board having copper clad laminate laminated on core layer,...

Patents Applicationslast 30 patents

IMAGE SENSOR

ELECTRONIC DEVICE INCLUDING SUBSTRATE INCLUDING COATING LAYER

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

IMAGE SENSOR

IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME

FLEXIBLE CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISING SAME

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

IMAGE SENSOR AND METHOD OF FABRICATING THE SAME

ELECTRONIC DEVICE INCLUDING THERMOSETTING BONDING SHEET

FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE...

PRINTED CIRCUIT BOARD FOR TRANSMITTING SIGNAL IN HIGH-FREQUENCY BAN...

RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE COMPRISI...

RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDIN...

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE HAVING THE SAME

CIRCUIT BOARD HAVING COPPER CLAD LAMINATE LAMINATED ON CORE LAYER,...