Jongmyeong Lee

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring structure and electronic device employing the same
- Patent number 11,978,704
- Issue date May 7, 2024
- Samsung Electronics Co., Ltd.
- Changseok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including transparent conductive oxide layer
- Patent number 11,456,314
- Issue date Sep 27, 2022
- Samsung Electronics Co., Ltd.
- Changsoo Lee
- G11 - INFORMATION STORAGE
Information Patent Grant
Capacitor and a semiconductor device including the same
- Patent number 9,997,591
- Issue date Jun 12, 2018
- Samsung Electronics Co., Ltd.
- Jin-su Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device including a first ILD w...
- Patent number 9,780,113
- Issue date Oct 3, 2017
- Samsung Electronics Co., Ltd.
- Jiwoon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,570,448
- Issue date Feb 14, 2017
- Samsung Electronics Co., Ltd.
- Youn-Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including a non-planar conductive pattern, an...
- Patent number 9,142,489
- Issue date Sep 22, 2015
- Samsung Electronics Co., Ltd.
- Jongwon Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including interlayer conductive contacts and...
- Patent number 8,404,593
- Issue date Mar 26, 2013
- Samsung Electronics Co., Ltd.
- Jongwon Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal interconnect of semiconductor device
- Patent number 8,319,348
- Issue date Nov 27, 2012
- Samsung Electronics Co., Ltd.
- Jongmyeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal patterns in openings in semiconductor devices
- Patent number 8,258,058
- Issue date Sep 4, 2012
- Samsung Electronic Co., Ltd.
- Tsukasa Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming metal patterns in openings in semiconductor devices
- Patent number 8,148,261
- Issue date Apr 3, 2012
- Samsung Electronics Co., Ltd.
- Tsukasa Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including interlayer conductive contacts and...
- Patent number 7,888,798
- Issue date Feb 15, 2011
- Samsung Electronics Co., Ltd.
- Jongwon Hong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TRANSPARENT CONDUCTIVE OXIDE LAYER
- Publication number 20210104538
- Publication date Apr 8, 2021
- Samsung Electronics Co., Ltd.
- Changsoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND ELECTRONIC DEVICE EMPLOYING THE SAME
- Publication number 20200350256
- Publication date Nov 5, 2020
- Samsung Electronics Co., Ltd.
- Changseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR AND A SEMICONDUCTOR DEVICE INCLUDING THE SAME
- Publication number 20170069711
- Publication date Mar 9, 2017
- Samsung Electronics Co., Ltd.
- Jin-su LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160379985
- Publication date Dec 29, 2016
- Samsung Electronics Co., Ltd.
- Youn-Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING A GAS MIXER
- Publication number 20160362785
- Publication date Dec 15, 2016
- Samsung Electronics Co., Ltd.
- Dongyoung KIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20160233232
- Publication date Aug 11, 2016
- Jiwoon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE AND ELECTRONIC DEVICE EMPLOYING THE SAME
- Publication number 20150235959
- Publication date Aug 20, 2015
- Samsung Electronics Co., Ltd.
- Changseok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabricating a Semiconductor Device
- Publication number 20150031195
- Publication date Jan 29, 2015
- Samsung Electronics Co., Ltd.
- Eun Tae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE
- Publication number 20140080302
- Publication date Mar 20, 2014
- Samsung Electronics Co., Ltd.
- Tsukasa MATSUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING A NON-PLANAR CONDUCTIVE PATTERN, AN...
- Publication number 20140042633
- Publication date Feb 13, 2014
- Samsung Electronics Co., Ltd.
- Jongwon Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20130147022
- Publication date Jun 13, 2013
- Samsung Electronics Co., Ltd.
- Jung-soo YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Metal Patterns in Openings in Semiconductor Devices
- Publication number 20120164826
- Publication date Jun 28, 2012
- Tsukasa Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming the Same
- Publication number 20110195569
- Publication date Aug 11, 2011
- Kwangjin Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING INTERLAYER CONDUCTIVE CONTACTS AND...
- Publication number 20110097895
- Publication date Apr 28, 2011
- Samsung Electronics Co., Ltd.
- Jongwon Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Interconnect of Semiconductor Device
- Publication number 20100230824
- Publication date Sep 16, 2010
- Jongmyeong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Metal Patterns in Openings in Semiconductor Devices
- Publication number 20100227473
- Publication date Sep 9, 2010
- Tsukasa Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor devices including interlayer conductive contacts and...
- Publication number 20080284006
- Publication date Nov 20, 2008
- Samsung Electronics Co., Ltd.
- Jongwon Hong
- H01 - BASIC ELECTRIC ELEMENTS

Jongmyeong Lee

Person

Patents Grantslast 30 patents

Wiring structure and electronic device employing the same

Semiconductor device including transparent conductive oxide layer

Capacitor and a semiconductor device including the same

Method for fabricating semiconductor device including a first ILD w...

Semiconductor device and method for manufacturing the same

Semiconductor devices including a non-planar conductive pattern, an...

Semiconductor devices including interlayer conductive contacts and...

Metal interconnect of semiconductor device

Methods of forming metal patterns in openings in semiconductor devices

Methods of forming metal patterns in openings in semiconductor devices

Semiconductor devices including interlayer conductive contacts and...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE INCLUDING TRANSPARENT CONDUCTIVE OXIDE LAYER

WIRING STRUCTURE AND ELECTRONIC DEVICE EMPLOYING THE SAME

CAPACITOR AND A SEMICONDUCTOR DEVICE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE HAVING A GAS MIXER

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

WIRING STRUCTURE AND ELECTRONIC DEVICE EMPLOYING THE SAME

Method of Fabricating a Semiconductor Device

METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES INCLUDING A NON-PLANAR CONDUCTIVE PATTERN, AN...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Methods of Forming Metal Patterns in Openings in Semiconductor Devices

Semiconductor Device and Method for Forming the Same

SEMICONDUCTOR DEVICES INCLUDING INTERLAYER CONDUCTIVE CONTACTS AND...

Metal Interconnect of Semiconductor Device

Methods of Forming Metal Patterns in Openings in Semiconductor Devices

Semiconductor devices including interlayer conductive contacts and...