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Suwon-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor package with curing layer between semiconductor chips
Patent number
11,842,982
Issue date
Dec 12, 2023
Samsung Electronics Co., Ltd.
Seon Ho Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages having improved reliability in bonds between...
Patent number
11,676,925
Issue date
Jun 13, 2023
Samsung Electronics Co., Ltd.
Jiseok Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor packages having improved reliability in bonds between...
Patent number
11,158,594
Issue date
Oct 26, 2021
Samsung Electronics Co., Ltd.
Jiseok Hong
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20220406755
Publication date
Dec 22, 2022
Samsung Electronics Co., Ltd.
Jongpa HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20220139873
Publication date
May 5, 2022
Samsung Electronics Co., Ltd.
Seon Ho LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
Publication number
20220068863
Publication date
Mar 3, 2022
Samsung Electronics Co., Ltd.
JISEOK HONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
Publication number
20210143116
Publication date
May 13, 2021
Samsung Electronics Co., Ltd.
JISEOK HONG
H01 - BASIC ELECTRIC ELEMENTS