JongVin Park

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with shielding spacer and metho...
- Patent number 8,569,870
- Issue date Oct 29, 2013
- Stats Chippac Ltd.
- SinJae Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with embedded conductive struct...
- Patent number 8,310,038
- Issue date Nov 13, 2012
- Stats Chippac Ltd.
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package stacking system
- Patent number 8,004,093
- Issue date Aug 23, 2011
- Stats Chippac Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package system with heat spreader
- Patent number 7,683,469
- Issue date Mar 23, 2010
- Stats Chippac Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EMBEDDED CONDUCTIVE STRUCT...
- Publication number 20120241967
- Publication date Sep 27, 2012
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM
- Publication number 20100025835
- Publication date Feb 4, 2010
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SYSTEM WITH HEAT SPREADER
- Publication number 20090294941
- Publication date Dec 3, 2009
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS