JONGWAN KIM

Person

CHEONAN-SI, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,581,266
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Jongwan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240128190
- Publication date Apr 18, 2024
- Samsung Electronics Co., Ltd.
- Seunghwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PROTECTION DEVICE
- Publication number 20240096748
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME
- Publication number 20240079342
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Taejun JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230395482
- Publication date Dec 7, 2023
- Samsung Electronics Co., Ltd.
- Jungjoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME
- Publication number 20230378094
- Publication date Nov 23, 2023
- Samsung Electronics Co., Ltd.
- Junwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING FIXING MEMBERS
- Publication number 20230260926
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230170310
- Publication date Jun 1, 2023
- Samsung Electronics Co., Ltd.
- JONGWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PRODUCT FOR SEMICONDUCTOR STRIP AND METHOD OF MANUFACTURING...
- Publication number 20230127641
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- Seunghwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING ELECTROMAGNETIC SHIELD STRUCTURE
- Publication number 20230114892
- Publication date Apr 13, 2023
- Samsung Electronics Co., Ltd.
- JONGWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230082412
- Publication date Mar 16, 2023
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE
- Publication number 20220367416
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Yongkwan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220068835
- Publication date Mar 3, 2022
- Samsung Electronics Co., Ltd.
- JONGWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220051957
- Publication date Feb 17, 2022
- Samsung Electronics Co., Ltd.
- KYONG HWAN KOH
- H01 - BASIC ELECTRIC ELEMENTS

JONGWAN KIM

Person

Patents Grantslast 30 patents

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

CHIP PROTECTION DEVICE

SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE HAVING THE SAME

SEMICONDUCTOR PACKAGES HAVING FIXING MEMBERS

SEMICONDUCTOR PACKAGE

MOLDED PRODUCT FOR SEMICONDUCTOR STRIP AND METHOD OF MANUFACTURING...

SEMICONDUCTOR PACKAGE INCLUDING ELECTROMAGNETIC SHIELD STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE HAVING PACKAGE SUBSTRATE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE