JONGWOO SHIN

Person

Pleasanton, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-variate gyroscope offset temperature coefficient compensation
- Patent number 12,339,136
- Issue date Jun 24, 2025
- Invensense, Inc.
- Zhongzheng Liu
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 12,319,562
- Issue date Jun 3, 2025
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 11,945,713
- Issue date Apr 2, 2024
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for operating a mems device based on sensed tem...
- Patent number 11,738,994
- Issue date Aug 29, 2023
- Invensense, Inc.
- David deKoninck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and system for sensor configuration
- Patent number 11,566,899
- Issue date Jan 31, 2023
- Karthik Katingari
- G01 - MEASURING TESTING
Information Patent Grant
Systems and methods for operating a MEMS device based on sensed tem...
- Patent number 11,548,780
- Issue date Jan 10, 2023
- Invensense, Inc.
- David deKoninck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for operating a MEMS device based on sensed tem...
- Patent number 11,186,479
- Issue date Nov 30, 2021
- Invensense, Inc.
- David deKoninck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vertical thermal gradient compensation in a z-axis MEMS accelerometer
- Patent number 11,073,531
- Issue date Jul 27, 2021
- Invensense, Inc.
- David deKoninck
- G01 - MEASURING TESTING
Information Patent Grant
Device comprising a micro-electro-mechanical system substrate with...
- Patent number 11,040,871
- Issue date Jun 22, 2021
- Invensense, Inc.
- Jongwoo Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Proof mass and polysilicon electrode integrated thereon
- Patent number 10,505,006
- Issue date Dec 10, 2019
- Invensense, Inc.
- Bongsang Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for providing getters in microelectromechanical...
- Patent number 10,384,930
- Issue date Aug 20, 2019
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integrated device including multiple cavities at differen...
- Patent number 10,221,065
- Issue date Mar 5, 2019
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integration of AIN ultrasonic transducer on a CMOS substrate using...
- Patent number 9,975,763
- Issue date May 22, 2018
- Invensense, Inc.
- Jong Il Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS-CMOS device that minimizes outgassing and methods of manufacture
- Patent number 9,862,593
- Issue date Jan 9, 2018
- Invensense, Inc.
- Peter Smeys
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integration using metal silicide formation
- Patent number 9,809,450
- Issue date Nov 7, 2017
- Invensense, Inc.
- Jong Il Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integration by sequential bonding method
- Patent number 9,761,557
- Issue date Sep 12, 2017
- Invensense, Inc.
- Jong Il Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Reduction of chipping damage to MEMS structure
- Patent number 9,738,511
- Issue date Aug 22, 2017
- Invensense, Inc.
- Jongwoo Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integrated device including multiple cavities at differen...
- Patent number 9,738,512
- Issue date Aug 22, 2017
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of increasing MEMS enclosure pressure using outgassing material
- Patent number 9,731,963
- Issue date Aug 15, 2017
- Invensense, Inc.
- Cerina Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
CMOS-MEMS integrated device including a contact layer and methods o...
- Patent number 9,718,680
- Issue date Aug 1, 2017
- Invensense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with electrodes permeable to outgassing species
- Patent number 9,663,349
- Issue date May 30, 2017
- Invensense, Inc.
- Jongwoo Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Film induced interface roughening and method of producing the same
- Patent number 9,611,133
- Issue date Apr 4, 2017
- Invensense, Inc.
- Fang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS-CMOS device that minimizes outgassing and methods of manufacture
- Patent number 9,540,228
- Issue date Jan 10, 2017
- Invensense, Inc.
- Peter Smeys
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Magnetic sensors with permanent magnets magnetized in different dir...
- Patent number 9,513,346
- Issue date Dec 6, 2016
- Invensense, Inc.
- Jong Il Shin
- G01 - MEASURING TESTING
Information Patent Grant
Device with magnetic sensors with permanent magnets
- Patent number 9,513,347
- Issue date Dec 6, 2016
- Invensense, Inc.
- Jong Il Shin
- G01 - MEASURING TESTING
Information Patent Grant
Method of increasing MEMS enclosure pressure using outgassing material
- Patent number 9,452,925
- Issue date Sep 27, 2016
- Invensense, Inc.
- Cerina Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Application specific integrated circuit with integrated magnetic se...
- Patent number 9,368,550
- Issue date Jun 14, 2016
- Invensense, Inc.
- Stephen Lloyd
- G01 - MEASURING TESTING
Information Patent Grant
Internal electrical contact for enclosed MEMS devices
- Patent number 9,221,676
- Issue date Dec 29, 2015
- Invensense, Inc.
- Kegang Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Internal electrical contact for enclosed MEMS devices
- Patent number 8,945,969
- Issue date Feb 3, 2015
- Invensense, Inc.
- Kegang Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Internal electrical contact for enclosed MEMS devices
- Patent number 8,822,252
- Issue date Sep 2, 2014
- Invensense, Inc.
- Kegang Huang
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Multi-Variate Gyroscope Offset Temperature Coefficient Compensation
- Publication number 20240318979
- Publication date Sep 26, 2024
- InvenSense, Inc.
- Zhongzheng Liu
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR OPERATING A MEMS DEVICE BASED ON SENSED TEM...
- Publication number 20230107211
- Publication date Apr 6, 2023
- InvenSense, Inc.
- David deKoninck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...
- Publication number 20220348455
- Publication date Nov 3, 2022
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SYSTEMS AND METHODS FOR OPERATING A MEMS DEVICE BASED ON SENSED TEM...
- Publication number 20220048760
- Publication date Feb 17, 2022
- InvenSense, Inc.
- David deKoninck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
VERTICAL THERMAL GRADIENT COMPENSATION IN A Z-AXIS MEMS ACCELEROMETER
- Publication number 20210055321
- Publication date Feb 25, 2021
- InvenSense, Inc.
- David deKoninck
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR OPERATING A MEMS DEVICE BASED ON SENSED TEM...
- Publication number 20210053819
- Publication date Feb 25, 2021
- InvenSense, Inc.
- David deKoninck
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD AND SYSTEM FOR SENSOR CONFIGURATION
- Publication number 20200348134
- Publication date Nov 5, 2020
- InvenSense, Inc.
- Karthik Katingari
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...
- Publication number 20190330052
- Publication date Oct 31, 2019
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE COMPRISING A MICRO-ELECTRO-MECHANICAL SYSTEM SUBSTRATE WITH...
- Publication number 20190185317
- Publication date Jun 20, 2019
- InvenSense, Inc.
- Jongwoo Shin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROOF MASS AND POLYSILICON ELECTRODE INTEGRATED THEREON
- Publication number 20190035905
- Publication date Jan 31, 2019
- InvenSense, Inc.
- Bongsang KIM
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...
- Publication number 20180312396
- Publication date Nov 1, 2018
- InvenSense, Inc.
- Daesung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATION OF AIN ULTRASONIC TRANSDUCER ON A CMOS SUBSTRATE USING...
- Publication number 20170275158
- Publication date Sep 28, 2017
- InvenSense, Inc.
- Jong Il SHIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS INTEGRATED DEVICE INCLUDING MULTIPLE CAVITIES AT DIFFEREN...
- Publication number 20170183225
- Publication date Jun 29, 2017
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS-CMOS DEVICE THAT MINIMIZES OUTGASSING AND METHODS OF MANUFACTURE
- Publication number 20170073217
- Publication date Mar 16, 2017
- InvenSense, Inc.
- Peter SMEYS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS INTEGRATION USING METAL SILICIDE FORMATION
- Publication number 20170057813
- Publication date Mar 2, 2017
- InvenSense, Inc.
- Jong Il SHIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF INCREASING MEMS ENCLOSURE PRESSURE USING OUTGASSING MATERIAL
- Publication number 20170001861
- Publication date Jan 5, 2017
- InvenSense, Inc.
- Cerina Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH ELECTRODES PERMEABLE TO OUTGASSING SPECIES
- Publication number 20160376143
- Publication date Dec 29, 2016
- InvenSense, Inc.
- Jongwoo SHIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS INTEGRATED DEVICE INCLUDING A CONTACT LAYER AND METHODS O...
- Publication number 20160362296
- Publication date Dec 15, 2016
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS-CMOS DEVICE THAT MINIMIZES OUTGASSING AND METHODS OF MANUFACTURE
- Publication number 20160221819
- Publication date Aug 4, 2016
- InvenSense, Inc.
- Peter SMEYS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FILM INDUCED INTERFACE ROUGHENING AND METHOD OF PRODUCING THE SAME
- Publication number 20160115016
- Publication date Apr 28, 2016
- InvenSense, Inc.
- Fang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERNAL BARRIER FOR ENCLOSED MEMS DEVICES
- Publication number 20160075554
- Publication date Mar 17, 2016
- InvenSense, Inc.
- Anatole HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD OF INCREASING MEMS ENCLOSURE PRESSURE USING OUTGASSING MATERIAL
- Publication number 20150360939
- Publication date Dec 17, 2015
- INVENSENSE, INC.
- Cerina Zhang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTERNAL ELECTRICAL CONTACT FOR ENCLOSED MEMS DEVICES
- Publication number 20150336792
- Publication date Nov 26, 2015
- InvenSense, Inc.
- Kegang HUANG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMOS-MEMS INTEGRATION BY SEQUENTIAL BONDING METHOD
- Publication number 20150311178
- Publication date Oct 29, 2015
- InvenSense, Inc.
- Jong Il SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO IMPROVE SURFACE ROUGHNESS AND ELIMINATE SHARP CORNERS ON...
- Publication number 20150274517
- Publication date Oct 1, 2015
- InvenSense, Inc.
- Peter SMEYS
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MAGNETIC SENSORS WITH PERMANENT MAGNETS MAGNETIZED IN DIFFERENT DIR...
- Publication number 20150192646
- Publication date Jul 9, 2015
- NVENSENSE, INC.
- JONG IL SHIN
- G01 - MEASURING TESTING
Information Patent Application
CMOS-MEMS INTEGRATED DEVICE INCLUDING MULTIPLE CAVITIES AT DIFFEREN...
- Publication number 20150129991
- Publication date May 14, 2015
- InvenSense, Inc.
- Daesung LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE WITH MAGNETIC SENSORS WITH PERMANENT MAGNETS
- Publication number 20150115952
- Publication date Apr 30, 2015
- InvenSense, Inc.
- JONG IL SHIN
- G01 - MEASURING TESTING
Information Patent Application
REDUCTION OF CHIPPING DAMAGE TO MEMS STRUCTURE
- Publication number 20150076631
- Publication date Mar 19, 2015
- InvenSense, Inc.
- Jongwoo SHIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPLICATION SPECIFIC INTEGRATED CIRCUIT WITH INTEGRATED MAGNETIC SE...
- Publication number 20150021727
- Publication date Jan 22, 2015
- InvenSense, Inc.
- STEPHEN LLOYD
- H01 - BASIC ELECTRIC ELEMENTS

JONGWOO SHIN

Person

Patents Grantslast 30 patents

Multi-variate gyroscope offset temperature coefficient compensation

Systems and methods for providing getters in microelectromechanical...

Systems and methods for providing getters in microelectromechanical...

Systems and methods for operating a mems device based on sensed tem...

Method and system for sensor configuration

Systems and methods for operating a MEMS device based on sensed tem...

Systems and methods for operating a MEMS device based on sensed tem...

Vertical thermal gradient compensation in a z-axis MEMS accelerometer

Device comprising a micro-electro-mechanical system substrate with...

Proof mass and polysilicon electrode integrated thereon

Systems and methods for providing getters in microelectromechanical...

CMOS-MEMS integrated device including multiple cavities at differen...

Integration of AIN ultrasonic transducer on a CMOS substrate using...

MEMS-CMOS device that minimizes outgassing and methods of manufacture

CMOS-MEMS integration using metal silicide formation

CMOS-MEMS integration by sequential bonding method

Reduction of chipping damage to MEMS structure

CMOS-MEMS integrated device including multiple cavities at differen...

Method of increasing MEMS enclosure pressure using outgassing material

CMOS-MEMS integrated device including a contact layer and methods o...

MEMS device with electrodes permeable to outgassing species

Film induced interface roughening and method of producing the same

MEMS-CMOS device that minimizes outgassing and methods of manufacture

Magnetic sensors with permanent magnets magnetized in different dir...

Device with magnetic sensors with permanent magnets

Method of increasing MEMS enclosure pressure using outgassing material

Application specific integrated circuit with integrated magnetic se...

Internal electrical contact for enclosed MEMS devices

Internal electrical contact for enclosed MEMS devices

Internal electrical contact for enclosed MEMS devices

Patents Applicationslast 30 patents

Multi-Variate Gyroscope Offset Temperature Coefficient Compensation

SYSTEMS AND METHODS FOR OPERATING A MEMS DEVICE BASED ON SENSED TEM...

SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...

SYSTEMS AND METHODS FOR OPERATING A MEMS DEVICE BASED ON SENSED TEM...

VERTICAL THERMAL GRADIENT COMPENSATION IN A Z-AXIS MEMS ACCELEROMETER

SYSTEMS AND METHODS FOR OPERATING A MEMS DEVICE BASED ON SENSED TEM...

METHOD AND SYSTEM FOR SENSOR CONFIGURATION

SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...

DEVICE COMPRISING A MICRO-ELECTRO-MECHANICAL SYSTEM SUBSTRATE WITH...

PROOF MASS AND POLYSILICON ELECTRODE INTEGRATED THEREON

SYSTEMS AND METHODS FOR PROVIDING GETTERS IN MICROELECTROMECHANICAL...

INTEGRATION OF AIN ULTRASONIC TRANSDUCER ON A CMOS SUBSTRATE USING...

CMOS-MEMS INTEGRATED DEVICE INCLUDING MULTIPLE CAVITIES AT DIFFEREN...

MEMS-CMOS DEVICE THAT MINIMIZES OUTGASSING AND METHODS OF MANUFACTURE

CMOS-MEMS INTEGRATION USING METAL SILICIDE FORMATION

METHOD OF INCREASING MEMS ENCLOSURE PRESSURE USING OUTGASSING MATERIAL

MEMS DEVICE WITH ELECTRODES PERMEABLE TO OUTGASSING SPECIES

CMOS-MEMS INTEGRATED DEVICE INCLUDING A CONTACT LAYER AND METHODS O...

MEMS-CMOS DEVICE THAT MINIMIZES OUTGASSING AND METHODS OF MANUFACTURE

FILM INDUCED INTERFACE ROUGHENING AND METHOD OF PRODUCING THE SAME

INTERNAL BARRIER FOR ENCLOSED MEMS DEVICES

METHOD OF INCREASING MEMS ENCLOSURE PRESSURE USING OUTGASSING MATERIAL

INTERNAL ELECTRICAL CONTACT FOR ENCLOSED MEMS DEVICES

CMOS-MEMS INTEGRATION BY SEQUENTIAL BONDING METHOD

METHOD TO IMPROVE SURFACE ROUGHNESS AND ELIMINATE SHARP CORNERS ON...

MAGNETIC SENSORS WITH PERMANENT MAGNETS MAGNETIZED IN DIFFERENT DIR...

CMOS-MEMS INTEGRATED DEVICE INCLUDING MULTIPLE CAVITIES AT DIFFEREN...

DEVICE WITH MAGNETIC SENSORS WITH PERMANENT MAGNETS

REDUCTION OF CHIPPING DAMAGE TO MEMS STRUCTURE

APPLICATION SPECIFIC INTEGRATED CIRCUIT WITH INTEGRATED MAGNETIC SE...