Joo Han Kim

Person

Niskayuna, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronics chassis with oscillating heat pipe (OHP)
- Patent number 11,112,840
- Issue date Sep 7, 2021
- Abaco Systems, Inc.
- Joo Han Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Apparatus and method for passive cooling of electronic devices
- Patent number 10,366,817
- Issue date Jul 30, 2019
- General Electric Company
- Joo Han Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
System for thermal management in electrical machines
- Patent number 10,277,096
- Issue date Apr 30, 2019
- General Electric Company
- Karthik Kumar Bodla
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
System and method for passively cooling an enclosure
- Patent number 10,220,725
- Issue date Mar 5, 2019
- GE Global Sourcing LLC
- Brian Magann Rush
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Thermal management systems and methods for heat generating electronics
- Patent number 10,136,557
- Issue date Nov 20, 2018
- General Electric Company
- Joo Han Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Reusable phase-change thermal interface structures
- Patent number 9,826,662
- Issue date Nov 21, 2017
- General Electric Company
- Joo Han Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Dielectric fluids for linear switched capacitive devices
- Patent number 9,806,639
- Issue date Oct 31, 2017
- General Electric Company
- Qin Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Circuit card assembly including heat transfer assembly and method o...
- Patent number 9,750,127
- Issue date Aug 29, 2017
- General Electric Company
- Joo Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermal interface devices
- Patent number 9,615,486
- Issue date Apr 4, 2017
- General Electric Company
- Hendrik Pieter Jacobus De Bock
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit card assembly and method of manufacturing thereof
- Patent number 9,370,090
- Issue date Jun 14, 2016
- General Electric Company
- Shakti Singh Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit card assembly and method of fabricating the same
- Patent number 9,253,871
- Issue date Feb 2, 2016
- General Electric Company
- Joo Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
IMPINGEMENT COOLING PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK
- Publication number 20240107714
- Publication date Mar 28, 2024
- Abaco Systems, Inc.
- Lucius AKALANNE
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
COOLING MODULE FOR PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK
- Publication number 20240032255
- Publication date Jan 25, 2024
- Abaco Systems, Inc.
- Joo Han KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CARD ASSEMBLIES
- Publication number 20230134978
- Publication date May 4, 2023
- AMETEK, INC.
- Joo-Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TEMPERATURE DEPENDENT ELECTRONIC COMPONENT HEATING SYSTEM
- Publication number 20230062660
- Publication date Mar 2, 2023
- AMETEK, INC.
- Brian Hoden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTION COOLED CHASSIS
- Publication number 20230025346
- Publication date Jan 26, 2023
- AMETEK, INC.
- Peter Kortekaas
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONICS CHASSIS WITH OSCILLATING HEAT PIPE (OHP)
- Publication number 20210055770
- Publication date Feb 25, 2021
- Abaco Systems, Inc.
- Joo Han Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
APPARATUS AND METHOD FOR PASSIVE COOLING OF ELECTRONIC DEVICES
- Publication number 20180322995
- Publication date Nov 8, 2018
- GENERAL ELECTRIC COMPANY
- Joo Han Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL MANAGEMENT SYSTEMS AND METHODS FOR HEAT GENERATING ELECTRONICS
- Publication number 20170164517
- Publication date Jun 8, 2017
- GENERAL ELECTRIC COMPANY
- Joo Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT CARD ASSEMBLY INCLUDING HEAT TRANSFER ASSEMBLY AND METHOD O...
- Publication number 20170164459
- Publication date Jun 8, 2017
- GENERAL ELECTRIC COMPANY
- Joo Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM FOR THERMAL MANAGEMENT IN ELECTRICAL MACHINES
- Publication number 20170141654
- Publication date May 18, 2017
- GENERAL ELECTRIC COMPANY
- Karthik Kumar Bodla
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SYSTEM AND METHOD FOR PASSIVELY COOLING AN ENCLOSURE
- Publication number 20160338221
- Publication date Nov 17, 2016
- GENERAL ELECTRIC COMPANY
- Brian Magann Rush
- B60 - VEHICLES IN GENERAL
Information Patent Application
DIELECTRIC FLUIDS FOR LINEAR SWITCHED CAPACITIVE DEVICES
- Publication number 20160322918
- Publication date Nov 3, 2016
- GENERAL ELECTRIC COMPANY
- Qin Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
CIRCUIT CARD ASSEMBLY AND METHOD OF MANUFACTURING THEREOF
- Publication number 20160095199
- Publication date Mar 31, 2016
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL INTERFACE DEVICES
- Publication number 20150282380
- Publication date Oct 1, 2015
- GENERAL ELECTRIC COMPANY
- Hendrik Pieter Jacobus De Bock
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REUSABLE PHASE-CHANGE THERMAL INTERFACE STRUCTURES
- Publication number 20150168087
- Publication date Jun 18, 2015
- GENERAL ELECTRIC COMPANY
- Joo Han Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CIRCUIT CARD ASSEMBLY AND METHOD OF FABRICATING THE SAME
- Publication number 20150116940
- Publication date Apr 30, 2015
- GENERAL ELECTRIC COMPANY
- Joo Han Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT TRANSFER DEVICE HAVING 3-DIMENSIONAL PROJECTIONS AND AN ASSOCI...
- Publication number 20150090428
- Publication date Apr 2, 2015
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
COOLING SYSTEM FOR METALLURGICAL FURNACES AND METHODS OF OPERATION
- Publication number 20150084246
- Publication date Mar 26, 2015
- GENERAL ELECTRIC COMPANY
- Ching Jen Tang
- F27 - FURNACES KILNS OVENS RETORTS

Joo Han Kim

Person

Patents Grantslast 30 patents

Electronics chassis with oscillating heat pipe (OHP)

Apparatus and method for passive cooling of electronic devices

System for thermal management in electrical machines

System and method for passively cooling an enclosure

Thermal management systems and methods for heat generating electronics

Reusable phase-change thermal interface structures

Dielectric fluids for linear switched capacitive devices

Circuit card assembly including heat transfer assembly and method o...

Thermal interface devices

Circuit card assembly and method of manufacturing thereof

Circuit card assembly and method of fabricating the same

Patents Applicationslast 30 patents

IMPINGEMENT COOLING PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK

COOLING MODULE FOR PROVIDING ENHANCED LOCALIZED COOLING OF A HEATSINK

CIRCUIT CARD ASSEMBLIES

TEMPERATURE DEPENDENT ELECTRONIC COMPONENT HEATING SYSTEM

CONDUCTION COOLED CHASSIS

ELECTRONICS CHASSIS WITH OSCILLATING HEAT PIPE (OHP)

APPARATUS AND METHOD FOR PASSIVE COOLING OF ELECTRONIC DEVICES

THERMAL MANAGEMENT SYSTEMS AND METHODS FOR HEAT GENERATING ELECTRONICS

CIRCUIT CARD ASSEMBLY INCLUDING HEAT TRANSFER ASSEMBLY AND METHOD O...

SYSTEM FOR THERMAL MANAGEMENT IN ELECTRICAL MACHINES

SYSTEM AND METHOD FOR PASSIVELY COOLING AN ENCLOSURE

DIELECTRIC FLUIDS FOR LINEAR SWITCHED CAPACITIVE DEVICES

CIRCUIT CARD ASSEMBLY AND METHOD OF MANUFACTURING THEREOF

THERMAL INTERFACE DEVICES

REUSABLE PHASE-CHANGE THERMAL INTERFACE STRUCTURES

CIRCUIT CARD ASSEMBLY AND METHOD OF FABRICATING THE SAME

HEAT TRANSFER DEVICE HAVING 3-DIMENSIONAL PROJECTIONS AND AN ASSOCI...

COOLING SYSTEM FOR METALLURGICAL FURNACES AND METHODS OF OPERATION