Joo Wan Hong

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Seongnam-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package including heat dissipation layer
- Patent number 11,699,684
- Issue date Jul 11, 2023
- SK hynix Inc.
- Joo Wan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including interconnectors and methods of fab...
- Patent number 9,941,253
- Issue date Apr 10, 2018
- SK hynix Inc.
- Yeon Seung Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYER
- Publication number 20230317683
- Publication date Oct 5, 2023
- SK HYNIX INC.
- Joo Wan HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION LAYER
- Publication number 20220173072
- Publication date Jun 2, 2022
- SK HYNIX INC.
- Joo Wan HONG
- H01 - BASIC ELECTRIC ELEMENTS