Joo-Yang EOM

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Bucheon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 8,860,196
- Issue date Oct 14, 2014
- Fairchild Korea Semiconductor Ltd.
- Joo-yang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink package
- Patent number 8,604,606
- Issue date Dec 10, 2013
- Fairchild Korea Semiconductor, Ltd.
- Joo-Yang Eom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-chip package
- Patent number 7,936,054
- Issue date May 3, 2011
- Fairchild Korea Semiconductor Ltd.
- Joo-yang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink package
- Patent number 7,786,570
- Issue date Aug 31, 2010
- Fairchild Korea Semiconductor, Ltd.
- Joo-Yang Eom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Heat Sink Package
- Publication number 20140217572
- Publication date Aug 7, 2014
- Fairchild Korea Semiconductor, Ltd.
- Joo-yang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20120168919
- Publication date Jul 5, 2012
- Joo-Yang EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK PACKAGE
- Publication number 20100289137
- Publication date Nov 18, 2010
- Fairchild Korea Semiconductor, Ltd.
- Joo-yang Eom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT SINK PACKAGE
- Publication number 20090194869
- Publication date Aug 6, 2009
- Fairchild Korea Semiconductor, Ltd.
- Joo-yang Eom
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multi-chip package
- Publication number 20090174044
- Publication date Jul 9, 2009
- Joo-yang Eom
- H01 - BASIC ELECTRIC ELEMENTS