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Bukit Mertajam, MY
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last 30 patents
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Patent Application
COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE
Publication number
20240234234
Publication date
Jul 11, 2024
Intel Corporation
Min Suet Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED INDUCTOR OVER TRANSISTOR LAYER
Publication number
20240234303
Publication date
Jul 11, 2024
Intel Corporation
Min Suet LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED INDUCTOR OVER TRANSISTOR LAYER
Publication number
20240136279
Publication date
Apr 25, 2024
Intel Corporation
Min Suet LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER FILL FOR HEAT MANAGEMENT IN INTEGRATED CIRCUIT DEVICE
Publication number
20240136243
Publication date
Apr 25, 2024
Intel Corporation
Min Suet Lim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTOR TO ELECTRICALLY COUPLE MULTIPLE SUBSTRATES
Publication number
20240106139
Publication date
Mar 28, 2024
Intel Corporation
Jiun Hann SIR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIELD TO REDUCE SUBSTRATE ELECTROMAGNETIC INTERFERENCE AND WARPAGE
Publication number
20240006336
Publication date
Jan 4, 2024
Intel Corporation
Telesphor KAMGAING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRICAL CONDUCTOR EXTENDING FROM A SURFACE OF A SUBSTRATE
Publication number
20230420354
Publication date
Dec 28, 2023
Intel Corporation
Telesphor KAMGAING
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYPER DENSITY PACKAGE SUBSTRATE AND MEMORY COUPLED TO A MODIFIED SE...
Publication number
20230420350
Publication date
Dec 28, 2023
Intel Corporation
Kavitha NAGARAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SLOTTED STIFFENER FOR A PACKAGE SUBSTRATE
Publication number
20230420384
Publication date
Dec 28, 2023
Intel Corporation
Kavitha NAGARAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER RINGS FOR BGA COUNT REDUCTION IN SMALL FORM FACTOR PACKAGES
Publication number
20230420345
Publication date
Dec 28, 2023
Intel Corporation
Kavitha NAGARAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MEMORY ON PACKAGE (MOP) ARCHITECTURE
Publication number
20230395576
Publication date
Dec 7, 2023
Intel Corporation
Eng Huat GOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ON PACKAGE INTERCONNECT ARCHITECTURE FOR HIGH-SPEED MEMORY
Publication number
20230395493
Publication date
Dec 7, 2023
Intel Corporation
Jooi Wah WONG
G11 - INFORMATION STORAGE
Information
Patent Application
ULTRA-LASER THOUGH HOLE (ULTH) BY MULTI-STACKED CORE CONCEPT
Publication number
20230397333
Publication date
Dec 7, 2023
Intel Corporation
Eng Huat GOH
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
MEMORY PACKAGE ON EXTENDED BASE DIE OVER SOC DIE FOR PACKAGE LAYER...
Publication number
20230395578
Publication date
Dec 7, 2023
Intel Corporation
Min Suet LIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOC-MEMORY INTEGRATION TO ACHIEVE SMALLEST AND THINNEST MEMORY ON P...
Publication number
20230395577
Publication date
Dec 7, 2023
Intel Corporation
Eng Huat GOH
H01 - BASIC ELECTRIC ELEMENTS